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Haseeb Ashraf Malik

Researcher at University of Electronic Science and Technology of China

Publications -  19
Citations -  629

Haseeb Ashraf Malik is an academic researcher from University of Electronic Science and Technology of China. The author has contributed to research in topics: Perovskite (structure) & Dopant. The author has an hindex of 10, co-authored 17 publications receiving 337 citations.

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Toward high-efficiency, hysteresis-less, stable perovskite solar cells: unusual doping of a hole-transporting material using a fluorine-containing hydrophobic Lewis acid

TL;DR: In this paper, a fluorine-containing hydrophobic Lewis acid dopant (LAD) was employed as an effective dopant for hole-transporting layer (HTL) to realize an exceptional fill factor of 0.81 and a record PCE as high as 19.01%.
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Novel approach toward hole-transporting layer doped by hydrophobic Lewis acid through infiltrated diffusion doping for perovskite solar cells

TL;DR: In this paper, an alternative processing route for doping of hole-transporting layer (HTL) with improved hole extraction and passivation of anionic Pb-I antisite defects at the perovskite/HTL heterojunction is reported for the first time in PSC, referred as the infiltrated diffusion doping (INDD) method.
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Intelligent Biomimetic Chameleon Skin with Excellent Self-Healing and Electrochromic Properties.

TL;DR: A copolymer film possessing biomimetic properties that simultaneously integrates electrochromic triphenylamine and self- healing Diels-Alder groups is presented, which acts like natural chameleon skin, which exhibits significant color variation and also possesses excellent self-healing properties.
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Toward Easy-to-Assemble, Large-Area Smart Windows: All-in-One Cross-Linked Electrochromic Material and Device

TL;DR: Great ions diffusivity, rapid colors switching, excellent stability and reliability, large-scale smart windows (30×35 cm2) are achieved by the all-in-one electrochromic material, which exhibit fascinating and promising features for a wide range of applications in buildings, airplanes, etc.