We present a comprehensive, up-to-date compilation of band parameters for the technologically important III–V zinc blende and wurtzite compound semiconductors: GaAs, GaSb, GaP, GaN, AlAs, AlSb, AlP, AlN, InAs, InSb, InP, and InN, along with their ternary and quaternary alloys. Based on a review of the existing literature, complete and consistent parameter sets are given for all materials. Emphasizing the quantities required for band structure calculations, we tabulate the direct and indirect energy gaps, spin-orbit, and crystal-field splittings, alloy bowing parameters, effective masses for electrons, heavy, light, and split-off holes, Luttinger parameters, interband momentum matrix elements, and deformation potentials, including temperature and alloy-composition dependences where available. Heterostructure band offsets are also given, on an absolute scale that allows any material to be aligned relative to any other.

Band parameters for III–V compound semiconductors and their alloys

A lighting device comprising first and second groups of solid state light emitters, which emit light having peak wavelength in ranges of from 430 nm to 480 nm, and first and second groups of lumiphors which emit light having dominant wavelength in the range of from 555 nm to 585 nm. In some embodiments, if current is supplied to a power line, a combination of (1) light exiting the lighting device which was emitted by the first group of emitters, and (2) light exiting the lighting device which was emitted by the first group of lumiphors would have a correlated color temperature which differs by at least 50 K from a correlated color temperature which would be emitted by a combination of (3) light exiting the lighting device which was emitted by the second group of emitters, and (4) light exiting the lighting device which was emitted by the second group of lumiphors.

Lighting device and lighting method

A nitride semiconductor light-emitting device has an active layer of a single-quantum well structure or multi-quantum well made of a nitride semiconductor containing indium and gallium. A first p-type clad layer made of a p-type nitride semiconductor containing aluminum and gallium is provided in contact with one surface of the active layer. A second p-type clad layer made of a p-type nitride semiconductor containing aluminum and gallium is provided on the first p-type clad layer. The second p-type clad layer has a larger band gap than that of the first p-type clad layer. An n-type semiconductor layer is provided in contact with the other surface of the active layer.

Nitride semiconductor light emitting device

We fabricated three types of high luminous efficacy white light emitting diodes (LEDs). The first was a white LED with a high luminous efficacy (?L) of 249?lm?W?1 and a high luminous flux (v) of 14.4?lm at a forward-bias current of 20?mA. This ?L was approximately triple that of a tri-phosphor fluorescent lamp (90?lm?W?1). The blue LED used as the excitation source in this white LED had a high output power (e) of 47.1?mW and a high external quantum efficiency (?ex) of 84.3%. The second was a high-power white LED, fabricated from the above high-power blue LED, and had a high e of 756?mW at 350?mA. v and ?L of the high-power white LED were 203?lm and 183?lm?W?1 at 350?mA, respectively. The third was a high-power white LED fabricated from four high-power blue LED dies. v and ?L of the high-power white LED were 1913?lm and 135?lm?W?1 at 1?A, respectively. The white LED had a higher flux than a 20?W-class fluorescent lamp and 1.5 times the luminous efficacy of a tri-phosphor fluorescent lamp (90?lm?W?1).

https://iopscience.iop.org/article/10.1088/0022-3727/43/35/354002/pdf

White light emitting diodes with super-high luminous efficacy

Provided is a light emitting diode (LED) manufactured by using a wafer bonding method and a method of manufacturing a LED by using a wafer bonding method. The wafer bonding method may include interposing a stress relaxation layer (33) formed of a metal between a semiconductor layer (20) and a bonding substrate (31). When the stress relaxation layer is used, stress between the bonding substrate and a growth substrate may be offset due to the flexibility of metal, and accordingly, bending or warpage of the bonding substrate may be reduced or prevented.

Light-emitting device and method of manufacturing the same

Ultraviolet (UV) light-emitting diodes (LEDs) with an InGaN multi-quantum-well (MQW) structure were fabricated on a patterned sapphire substrate (PSS) using a single growth process of metalorganic vapor phase epitaxy. In this study, the PSS with parallel grooves along the sapphire direction was fabricated by standard photolithography and subsequent reactive ion etching (RIE). The GaN layer grown by lateral epitaxy on a patterned substrate (LEPS) has a dislocation density of 1.5×108 cm-2. The LEPS-UV-LED chips were mounted on the Si bases in a flip-chip bonding arrangement. When the LEPS-UV-LED was operated at a forward-bias current of 20 mA at room temperature, the emission wavelength, the output power and the external quantum efficiency were estimated to be 382 nm, 15.6 mW and 24%, respectively. With increasing forward-bias current, the output power increased linearly and was estimated to be approximately 38 mW at 50 mA.

https://iopscience.iop.org/article/10.1143/JJAP.40.L583/pdf

High Output Power InGaN Ultraviolet Light-Emitting Diodes Fabricated on Patterned Substrates Using Metalorganic Vapor Phase Epitaxy

The internal quantum efficiency (IQE) of highly-efficient near-UV light-emitting diodes, which shows an external quantum efficiency of 43% at 406 nm, has been measured by excitation power and temperature-dependent photoluminescence (PL). Assuming peak PL quantum efficiency at 8 K is 100%, peak IQE at 300 K was measured to be as high as 63%. At the injected carrier density, which corresponds to 20 mA current injection, IQE and light extraction efficiency were estimated to be about 54% and 80%, respectively.

Internal quantum efficiency of highly-efficient InxGa1−xN-based near-ultraviolet light-emitting diodes

A GaN single crystal having a full width at half-maximum of the double-crystal X-ray rocking curve of 5-250 sec and a thickness of not less than 80 μm, a method for producing the GaN single crystal having superior quality and sufficient thickness permitting its use as a substrate and a semiconductor light emitting element having high luminance and high reliability, comprising, as a substrate, the GaN single crystal having superior quality and/or sufficient thickness permitting its use as a substrate.

GaN single crystal

A growth plane of substrate 1 is processed to have a concavo-convex surface. The bottom of the concave part may be masked. When a crystal is grown by vapor phase growth using this substrate, an ingredient gas does not sufficiently reach the inside of a concave part 12, and therefore, a crystal growth occurs only from an upper part of a convex part 11. As shown in FIG. 1(b), therefore, a crystal unit 20 occurs when the crystal growth is started, and as the crystal growth proceeds, films grown in the lateral direction from the upper part of the convex part 11 as a starting point are connected to cover the concavo-convex surface of the substrate 1, leaving a cavity 13 in the concave part, as shown in FIG. 1(c), thereby giving a crystal layer 2, whereby the semiconductor base of the present invention is obtained. In this case, the part grown in the lateral direction, or the upper part of the concave part 12 has a low dislocation region and the crystal layer prepared has high quality. The manufacturing method of the semiconductor crystal of the present invention divides this semiconductor base into the substrate 1 and the crystal layer 2 at the cavity part thereof to give a semiconductor crystal.

Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method

PROBLEM TO BE SOLVED: To provide a large chip type GaN based light emitting element having a light emitting pattern unlike before, for which etching workability is improved. SOLUTION: A laminated body S is formed on a substrate 1, a plurality of recessed parts h are formed on the laminated body S from an upper surface, and an n-type layer is exposed inside each recess. A p electrode P2 is provided in the remaining region of the upper surface of the laminated body S, and the p electrode is covered with an insulator layer m. The n-type layer exposed inside each recess is provided with an n electrode P1, and n electrodes are connected with each other by a conductor layer P3 connecting the recesses with each other over the insulator layer m, and the large chip type nitride semiconductor light emitting element is attained for which a light emitter is spread in a mesh shape. The laminated body S is composed of a nitride semiconductor and is provided with a laminated structure for which the n-type layer 2 and a p-type layer 4 hold a light emitting layer 3 therebetween for instance, and the n-type layer is positioned on a substrate side. COPYRIGHT: (C)2006,JPO&NCIPI

Hiroaki Okagawa

Papers

High Output Power InGaN Ultraviolet Light-Emitting Diodes Fabricated on Patterned Substrates Using Metalorganic Vapor Phase Epitaxy

Internal quantum efficiency of highly-efficient InxGa1−xN-based near-ultraviolet light-emitting diodes

GaN single crystal

Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method

Nitride semiconductor light emitting element