H
Hongbo Wang
Researcher at Istituto Italiano di Tecnologia
Publications - 37
Citations - 1244
Hongbo Wang is an academic researcher from Istituto Italiano di Tecnologia. The author has contributed to research in topics: Tactile sensor & Electromagnetic coil. The author has an hindex of 14, co-authored 35 publications receiving 710 citations. Previous affiliations of Hongbo Wang include University of Science and Technology of China & University of Leeds.
Papers
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Toward Perceptive Soft Robots: Progress and Challenges
TL;DR: The knowledge gap and promising solutions toward perceptive soft robots are discussed and analyzed to provide a perspective in this field and challenges and trends in developing multimodal sensors, stretchable conductive materials and electronic interfaces, modeling techniques, and data interpretation for soft robotic sensing are highlighted.
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Ultrastable and highly sensitive eddy current displacement sensor using self-temperature compensation
Hongbo Wang,Zhihua Feng +1 more
TL;DR: In this article, the authors proposed a self-temperature compensation method for eddy-current sensors (ECSs) to reduce the thermal drift of ECSs by two orders of magnitude.
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Noncontact Thickness Measurement of Metal Films Using Eddy-Current Sensors Immune to Distance Variation
Hongbo Wang,Wei Li,Zhihua Feng +2 more
TL;DR: The results of this paper revealed that online thickness measurement systems could be developed for various advanced industrial applications.
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Design methodology for magnetic field-based soft tri-axis tactile sensors
TL;DR: A general design methodology for magnetic field-based three-axis soft tactile sensors is presented, enabling researchers to easily develop specific tactile sensors for a variety of applications.
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Hydrogen-doped viscoplastic liquid metal microparticles for stretchable printed metal lines.
Selvaraj Veerapandian,Woosun Jang,Woosun Jang,Jae Bok Seol,Jae Bok Seol,Hongbo Wang,Minsik Kong,Kaliannan Thiyagarajan,Junghyeok Kwak,Gyeongbae Park,Gilwoon Lee,Wonjeong Suh,Insang You,Mehmet Emin Kilic,Anupam Giri,Lucia Beccai,Aloysius Soon,Unyong Jeong +17 more
TL;DR: In this article, hydrogen doping and polymer adsorption at the oxide surface of liquid metal microparticles increase the conductivity and viscoplastic behaviour of the oxide, leading to liquid-metal-based printed circuits with stable resistance up to 500% strain.