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Huaqing Xie

Researcher at Shanghai Second Polytechnic University

Publications -  186
Citations -  6984

Huaqing Xie is an academic researcher from Shanghai Second Polytechnic University. The author has contributed to research in topics: Thermal conductivity & Nanofluid. The author has an hindex of 33, co-authored 128 publications receiving 5038 citations. Previous affiliations of Huaqing Xie include Florida State University College of Arts and Sciences.

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Multi-walled carbon nanotube/silver nanoparticles used for thermal transportation

TL;DR: In this article, a green method was applied to prepare composites of multi-walled carbon nanotubes (MWNTs) decorated with silver nanoparticles (Ag-NPs), which were functionalized using ball milling technology in the presence of ammonium bicarbonate, and the traditional method of silver mirror was used to decorate MWNTs to obtain Ag/MWNT composite.
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The influence of nitrogen doping on thermal conductivity of carbon nanotubes

TL;DR: In this article, the influence of nitrogen doping on thermal conductivity of carbon nanotubes (CNTs) experimentally and theoretically was investigated by using thermal chemical vapor deposition method and were used to prepare silicone composites.
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Novel dielectric behaviors in PVDF‐based semiconductor composites

TL;DR: In this paper, the temperature dependence of dielectric behaviors of composites at wide filler concentration and wide frequency ranges was studied at the same processing condition, and it was shown that there are giant die-lectric constants as the concentration of filler is near the percolation threshold.
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Thermal Conductivity of Composite Materials Containing Copper Nanowires

TL;DR: In this paper, the experimental and theoretical investigations have been conducted to determine the effect of copper nanowires and copper nanoparticles CuNPs on the thermal conductivity of dimethicone nanocomposites.
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Advanced Thermal Interface Materials for Thermal Management

Abstract: Suitable temperature is a necessary condition for the normal operation of many devices, especially microelectronic devices. Therefore, heat dissipation has become a bottleneck in many fields. Furthermore, the largest thermal resistance in the process of heat transfer occurs between two solid surfaces due to the poor thermal conductivity of air that exists in the gaps. Replacing air with thermal interface materials (TIMs) is the fundamental way to solve the problem of heat dissipation. Consequently, TIMs are widely used in LED lighting, solar energy, microelectronics, electrical and electrical engineering, aerospace, defense and other fields (Figure 1a.). In the case of using TIMs, the interfacial thermal resistance consists of three parts (Figure 1b): two boundary thermal resistances (Rc1, Rc2) associated with the TIM contacting either side of the surface and a thermal resistance relative to the inherent properties of the TIMs (RBLT). 9