H
Hyungsoo Kim
Researcher at KAIST
Publications - 62
Citations - 672
Hyungsoo Kim is an academic researcher from KAIST. The author has contributed to research in topics: Capacitor & Jitter. The author has an hindex of 15, co-authored 52 publications receiving 647 citations.
Papers
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Journal ArticleDOI
Modeling and measurement of simultaneous switching noise coupling through signal via transition
TL;DR: This work proposes and confirmed a design methodology to minimize the SSN coupling based on an optimal via positioning approach and demonstrates that the amount of SSN noise coupling is strongly dependent not only on the position of the signal via, but also on the layer configuration of the multilayer PCB.
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High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions
TL;DR: In this paper, a high dielectric constant thin film electromagnetic bandgap (EBG) power distribution network (PDN) was used for the suppression of power/ground noises and radiated emissions in high-performance multilayer digital printed circuit boards (PCBs).
Journal ArticleDOI
Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs
TL;DR: In this paper, the authors measured and demonstrated the great advantages of embedded film capacitors in reducing power/ground inductive impedance and the suppression of SSN at frequencies up to 3 GHz for high-performance multilayer packages and PCBs.
Proceedings ArticleDOI
Effects of on-chip and off-chip decoupling capacitors on electromagnetic radiated emission
Jonghoon J. Kim,Hyungsoo Kim,Woonghwan Ryu,Joungho Kim,Young-hwan Yun,Soo-Hyung Kim,Seog-Heon Ham,Hyeong-Keon An,Yong-Hee Lee +8 more
TL;DR: In this article, the effects of the on-chip and off-chip decoupling capacitors to the power/ground bounce and the electromagnetic radiated emission were discussed and the design rule of the optimum placement of the decoupled capacitor was obtained.
Journal ArticleDOI
Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs
TL;DR: In this paper, the authors introduced a model of simultaneous switching noise coupling between the power/ground plane cavities through cutouts in high-speed and high-density multilayer packages and printed circuit boards (PCBs).