Imre Bakonyi

TL;DR: In this paper, a review of the progress achieved over the last one and a half decades on ED multilayer films with GMR effect and to critically evaluate the GMR results reported for various element combinations accessible to the electrodeposition (ED) technique for the preparation of FM/NM multi-layer films (ED multilayered nanowires will be treated very briefly only).

TL;DR: In this paper, Galvanostatic electrodeposition was used to produce Ni-Cu alloys and Ni 81 Cu 19 /Cu multilayers by direct current plating and two-pulse plating, respectively, from a sulfate/citrate electrolyte.

TL;DR: In this article, an analysis of both magnetic and magnetotransport properties is presented for electrodeposited multilayers prepared intentionally under conditions to make the superparamagnetic (SPM) magnetization contribution comparable to or larger than the ferromagnetic term.

TL;DR: In this article, the microstructure and electrical transport properties were investigated for d.c.-plated Ni electrodeposits prepared from different types of electrolysing bath with deposition current densities (i dep ) ranging from 2.5 to 50 A dm −2 onto either Cu or Ti substrates, which were subsequently removed from the deposits.

Abstract: Direct current plating, pulse plating, two-pulse plating, and reverse pulse plating were used to produce electrodeposited Co-Cu alloys and Co-Cu/Cu multilayers under galvanostatic control from an electrolyte containing CoSO 4 and CuSO 4 . Atomic force microscopy, X-ray diffraction, and transmission electron microscopy were used to study the sample structure and morphology. Direct current plating resulted in a Co 95 Cu 5 alloy with nearly equal amounts of face-centered cubic (fcc) and hexagonal close packed phases, while all pulsed current methods yielded multilayers with fcc structure, Giant magnetoresistance (GMR) behavior was observed in the multilayers with a maximum magnetoresistance (MR) ratio of about 9% as measured at 8 kOe. The shape of the MR curves and the magnitude of the GMR were very similar, regardless of the sign of the current between the Co deposition pulses. The results of structural studies also confirmed the formation of a multilayer structure for each pulsed electrodeposition mode. The conclusion was that the spontaneous exchange reaction between Co and Cu 2+ is responsible for the formation of a pure Cu layer even under reverse pulse plating conditions. The GMR of the multilayer deposits decreased with increasing bilayer number, due to the deterioration of the microstructure as the deposit grew.