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James M. Fitz-Gerald

Researcher at University of Virginia

Publications -  115
Citations -  2448

James M. Fitz-Gerald is an academic researcher from University of Virginia. The author has contributed to research in topics: Thin film & Laser. The author has an hindex of 26, co-authored 115 publications receiving 2201 citations. Previous affiliations of James M. Fitz-Gerald include University of Massachusetts Lowell & United States Naval Research Laboratory.

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A novel laser transfer process for direct writing of electronic and sensor materials

TL;DR: The MAPLE Direct Write (MAPLE DW) as mentioned in this paper is a new laser-based direct-write technique which combines the basic approach employed in laser-induced forward transfer (LIFT) with the unique advantages of matrix-assisted pulsed-laser evaporation (MLE) and is a maskless deposition process which operates in air and at room tempera- ture.
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High Strength and Ductility of Additively Manufactured 316L Stainless Steel Explained

TL;DR: In this article, a scanning electron microscope and electron backscattered diffraction (EBSD) analysis revealed a fine cellular-dendritic (0.5 to 2.μm) substructure inside large irregularly shaped grains.
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Pulsed laser deposition vs. matrix assisted pulsed laser evaporation for growth of biodegradable polymer thin films

TL;DR: In this article, the authors investigated the deposition characteristics of each technique at comparable conditions to gain insight into the transport and degradation mechanisms of each approach and concluded that it is possible to overlook substantial degradation when incomplete chemical analysis is conducted, and that the material ejection is likely due to contributions of nonlinear or nonhomogeneous laser light absorption rather than evaporation.
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New approach to laser direct writing active and passive mesoscopic circuit elements

TL;DR: In this paper, a matrix-assisted pulsed laser evaporation direct write (MAPLE DW) was proposed to produce a novel excimer laser driven direct writing technique which has demonstrated the deposition in air and at room temperature and with sub-10 μm resolution of active and passive prototype circuit elements on planar and nonplanar substrates.
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Engineered Interfaces for Adherent Diamond Coatings on Large Thermal-Expansion Coefficient Mismatched Substrates

TL;DR: In this article, a method to increase the adherence of diamond coatings on tungsten-carbide and stainless steel substrates is reported based on a substrate-modification process that creates a three-dimensional thermally and compositionally graded interface.