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Jean-Yves Rauch

Researcher at Centre national de la recherche scientifique

Publications -  67
Citations -  1594

Jean-Yves Rauch is an academic researcher from Centre national de la recherche scientifique. The author has contributed to research in topics: Thin film & Sputtering. The author has an hindex of 18, co-authored 65 publications receiving 1371 citations. Previous affiliations of Jean-Yves Rauch include Franche Comté Électronique Mécanique Thermique et Optique Sciences et Technologies & University of Franche-Comté.

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Evidence for complete surface wave band gap in a piezoelectric phononic crystal

TL;DR: A complete surface acoustic wave band gap is found experimentally in a two-dimensional square-lattice piezoelectric phononic crystal etched in lithium niobate, in good agreement with theoretical predictions.
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Comparison of corrosion behaviour of zinc in NaCl and in NaOH solutions. Part I: Corrosion layer characterization

TL;DR: In this article, the thickness evolution of the zinc corrosion layer was investigated by glow discharge optical emission spectroscopy (GDEOS) using scanning electron microscopy (SEM).
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High aspect ratio lithium niobate ridge waveguides fabricated by optical grade dicing

TL;DR: In this article, LiNbO3 ridge waveguides with smooth walls, aspect ratios larger than 500 and side-wall verticality of 88.5 cm were fabricated using optical grade dicing.
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Surface modification and aging studies of addition-curing silicone rubbers by oxygen plasma

TL;DR: In this article, three different types of room temperature vulcanized polydimethyl siloxane (RTV) PDMS from three different companies, namely, Sylgard 184 from Dow Corning, RTV 615 from GE Silicones and RTV 141 from Rhodia Chemicals, were characterized using contact angle measurements and ATR-FTIR and XPS spectroscopy.
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Manufacture of microfluidic glass chips by deep plasma etching, femtosecond laser ablation, and anodic bonding

TL;DR: In this paper, two dry subtractive techniques for the fabrication of microchannels in borosilicate glass were investigated, plasma etching and laser ablation, which achieved a depth up to 100m with a profile angle of 83°-88° and a smooth bottom of the etched structure (Ra below 3nm) at an etch rate of 0.9μm/min.