J
Jianguo Lin
Researcher at Imperial College London
Publications - 326
Citations - 8617
Jianguo Lin is an academic researcher from Imperial College London. The author has contributed to research in topics: Creep & Hot stamping. The author has an hindex of 41, co-authored 319 publications receiving 6679 citations. Previous affiliations of Jianguo Lin include Coventry Health Care & University of Birmingham.
Papers
More filters
Journal ArticleDOI
An integrated method for net-shape manufacturing components combining 3D additive manufacturing and compressive forming processes
TL;DR: In this paper, a new forming process has been proposed, which effectively combines AM and compressive forming, and significant improvement in mechanical properties has been found in the tensile tests as well hardness test.
Journal ArticleDOI
A review of force reduction methods in precision forging axisymmetric shapes
TL;DR: The main concentration of this study is on design features which can be incorporated in tooling and/or workpiece in order to assist in minimisation of forging load while achieving complete die filling.
Journal ArticleDOI
Three-dimensional virtual grain structure generation with grain size control
TL;DR: In this article, a 3D controlled Poisson Voronoi tessellation (CPVT) model was developed for generating 3D polycrystalline grain structures for micromechanics simulations.
Journal ArticleDOI
Investigation on metal flow and forming load of bi-metal gear hot forging process
TL;DR: In this paper, the authors presented the hot forging process of a bi-metal gear fabricated by two metals of steel (tooth ring material) and aluminum alloy (core material).
Journal ArticleDOI
Creep rupture of copper and aluminium alloy under combined loadings : experiments and their various descriptions
TL;DR: In this paper, a set of multiaxial mechanisms-based creep damage constitutive equations has been formulated on the basis of analysis of previous creep models and determined using experimental data achieved for both materials at three effective stress levels.