Jin Yao

TL;DR: A high-speed ring modulator that fits many of the ideal qualities for optical interconnect in future exascale supercomputers and fits in a compact 400 μm2 footprint is reported.

TL;DR: This work reports optical waveguides up to one meter long with 0.026 dB/cm loss fabricated in a 300nm thick SOI CMOS process and demonstrates a complete toolbox for ultralow-loss, high-density waveguide routing for macrochip interconnects.

TL;DR: In this article, the authors present an in-depth discussion of practical microring modulators in silicon, covering their performance metrics, design tradeoffs, optimization, p-n junction geometries, complex ring configurations, and tuning solutions.

TL;DR: In this paper, the authors quantify intrawafer and interwafer variation of the position and relative spacing of resonance wavelengths for the microring arrays and confirm prior predictions that the absolute resonance positions of such devices cannot be controlled across wafers or even across reticles within a wafer.

TL;DR: The scalable hybrid integration enables continued photonic device improvements by leveraging advanced CMOS technologies with maximum flexibility, which is critical for developing ultra-low power high performance photonic interconnects for future computing systems.