Substrate-integrated waveguide (SIW) technology represents an emerging and very promising candidate for the development of circuits and components operating in the microwave and millimetre-wave region. SIW structures are generally fabricated by using two rows of conducting cylinders or slots embedded in a dielectric substrate that connects two parallel metal plates, and permit the implementation of classical rectangular waveguide components in planar form, along with printed circuitry, active devices and antennas. This study aims to provide an overview of the recent advances in the modelling, design and technological implementation of SIW structures and components.

Review of substrate-integrated waveguide circuits and antennas

Substrate Integrated Waveguide (SIW) tech- nology is the most promising candidate for the implemen- tation of millimeter-wave (mm-wave) integrated circuits and systems for the next decade. Based on planar dielectric substrates with top and bottom metal layers perforated with metalized holes, SIW structures offer a compact, low loss, flexible, and cost-effective solution for integrating active circuits, passive components and radiating elements on the same substrate. This paper presents an overview of the current status and future trends of academic and in- dustrial research on SIW technology. The historical devel- opment of SIW components and circuits is briefly outlined, and the current research topics are discussed: they include the development of numerical techniques for the modeling and design of SIW components, the investigation of novel compact and broadband interconnects, the determination of design solutions for loss minimization. Future research trends are also discussed: they mainly aim at the imple- mentation of SIW components at higher frequency (60-350 GHz) and the integration of complete Systems-on-Substrate (SoS).

Current and Future Research Trends in Substrate Integrated Waveguide Technology

In this paper, a multilayer substrate integrated waveguide (SIW) four-way out-of-phase power divider is investigated. In a previous research (Eom , 2009), the four-way power division was studied by a 3-D mode coupling method, which was achieved by a vertical Y-junction as well as a lateral Y-junction of half mode substrate integrated waveguides (HMSIW) using a multilayer substrate. In this research, resistive coupling slots, for obtaining good isolation between four output ports and impedance matching at all the ports, are realized on the lateral HMSIW Y-junctions and the vertical HMSIW Y-junctions using isolation resistors. From the measurement results, excellent performances of insertion loss, isolation, impedance matching, and amplitude balancing were simultaneously achieved for the X-band range. It is expected that the proposed design of a multilayer substrate integrated waveguide (ML-SIW) power divider will play an important role in the future integration of compact multiway SIW circuits and systems.

Multilayer Substrate Integrated Waveguide Four-Way Out-of-Phase Power Divider

This paper presents a general overview of substrate integrated transmission lines, from the perspective of historical background and progress of guided-wave structures and their impacts on the development of microwave circuits and integration solutions. This is highlighted through a technology roadmap involving the categorized five generations of microwave circuits. In particular, the substrate integration technologies are reviewed and discussed with focus on technical features, design highlights, component developments, structures evolution, and systems integration. A number of examples are presented to showcase some of the selected milestone research and development activities and accomplishments in connection with substrate integrated transmission line technologies, with particular focus on substrate integrated waveguide (SIW) techniques. Practical applications and industrial interests are also presented with key references and technical results, which show more and more product developments in the end-user sectors. It can be found that the popularity of SIW techniques is closely related to the achieved seamless integration of planar and non-planar structures into a unified design space, thereby allowing the possibility of combining major advantages of all the structures while alleviating their potential drawbacks. The future perspectives of the substrate integration technology are discussed through five major research directions, which suggest potential impacts in the development of future generations of circuits and systems such as system-on-substrate (SoS).

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Substrate Integrated Transmission Lines: Review and Applications

A printed log-periodic dipole antenna (PLPDA) with multiple notched bands is proposed for ultrawideband (UWB) applications. The impedance bandwidth of 3.1 GHz-10.6 GHz with VSWR less than 2 is achieved based on the wideband property of the PLPDA as well as the half mode substrate integrated waveguide (HMSIW) Balun. Different from omnidirectional UWB antennas, the end-fire radiation pattern of the PLPDA is more stable within the UWB band. Multiple notched bands are generated by integrating U-shaped slots into the PLPDA for blocking the interference from other narrow band wireless communication systems. Several antennas with the notched frequencies of 3.5 GHz, 5.5 GHz, 6.8 GHz, and 8.5 GHz are designed, fabricated, and measured. The measured results are in agreement with the predicted results.

Ultrawideband Printed Log-Periodic Dipole Antenna With Multiple Notched Bands

In this letter, novel compact 3 dB double-slot and single-slot couplers are proposed and implemented based on folded half mode substrate integrated waveguide (FHMSIW) The size of the FHMSIW coupler is reduced by nearly 50% and 75% compared with half-mode substrate integrated waveguide coupler and substrate integrated waveguide coupler, respectively Prototype couplers at X-band are fabricated and measured and good performance in bandwidth, insertion loss, and balance are achieved

Jing Wei

Papers

Folded Half Mode Substrate Integrated Waveguide 3 dB Coupler