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Jongwon Seok

Researcher at Chung-Ang University

Publications -  89
Citations -  2197

Jongwon Seok is an academic researcher from Chung-Ang University. The author has contributed to research in topics: Magnetorheological fluid & Nonlinear system. The author has an hindex of 24, co-authored 89 publications receiving 1757 citations. Previous affiliations of Jongwon Seok include Samsung & Rensselaer Polytechnic Institute.

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Energy consumption reduction technology in manufacturing — A selective review of policies, standards, and research

TL;DR: In this paper, the authors investigated the literature about energy consumption reduction strategies, energy policies, and the state-of-the-art for energy-saving methods that are being pursued currently in several major countries.
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A multi-stable energy harvester: Dynamic modeling and bifurcation analysis

TL;DR: In this article, the dynamic and energy properties of a multi-stable bimorph cantilever energy harvester with magnetic attraction effect have been investigated and the mechanism that governs the formation of this multi-stability is thoroughly identified and examined thorough a bifurcation analysis performed on the system's equilibrium solutions.
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Development of the optimal bluff body for wind energy harvesting using the synergetic effect of coupled vortex induced vibration and galloping phenomena

TL;DR: In this article, the authors investigated the possibility of the synergetic effect of coupled VIV and galloping motions based on two types of widely applied cross-sectional shapes of a bluff body (circular and square cylinder).
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Modeling and parameter optimization for cutting energy reduction in MQL milling process

TL;DR: In this paper, a specific cutting energy model was developed based on an artificial neural network, where the Levenberg-Marquardt back propagation algorithm was implemented and the number of hidden layers was determined through comparison with controlled experimental data.
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Multiscale material removal modeling of chemical mechanical polishing

TL;DR: In this paper, a multiscale model for material removal during conventional chemical mechanical polishing (CMP) is described, where three spatial scales are considered in the integrated model: abrasive particle scale, asperity scale, and wafer scale.