K
Kemiao Jia
Researcher at University of Florida
Publications - 22
Citations - 457
Kemiao Jia is an academic researcher from University of Florida. The author has contributed to research in topics: Gyroscope & Bimorph. The author has an hindex of 9, co-authored 22 publications receiving 416 citations. Previous affiliations of Kemiao Jia include Freescale Semiconductor.
Papers
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Journal ArticleDOI
An Electrothermal Tip–Tilt–Piston Micromirror Based on Folded Dual S-Shaped Bimorphs
Kemiao Jia,Sagnik Pal,Huikai Xie +2 more
TL;DR: In this article, an electrothermally actuated tip-tilt-piston micromirror with a large optical aperture of 1 mm was designed and tested for biomedical imaging and laser beam steering.
Journal ArticleDOI
A Low-Power Low-Noise Dual-Chopper Amplifier for Capacitive CMOS-MEMS Accelerometers
TL;DR: In this paper, a dual-chopper amplifier and its application to monolithic complementary metal-oxide semiconductor-microelectromechanical systems accelerometers is presented. But the authors focus on the power consumption and noise.
Journal ArticleDOI
A piezoelectric unimorph actuator based tip-tilt-piston micromirror with high fill factor and small tilt and lateral shift
TL;DR: In this paper, a piezoelectrically actuated high-fill-factor tip-tilt-piston (TTP) micromirror with small tilt and lateral shift during scanning is presented.
Journal ArticleDOI
A tip-tilt-piston micromirror with a double S-shaped unimorph piezoelectric actuator
Wenjing Liu,Wenjing Liu,Yiping Zhu,Kemiao Jia,Wenjun Liao,Yongming Tang,Baoping Wang,Huikai Xie +7 more
TL;DR: In this article, a double S-shaped unimorph piezoelectric (dSUP) actuator design is employed to generate large vertical displacement with four actuators symmetrically located on the four sides of the mirror plate.
Journal ArticleDOI
High-Fill-Factor Micromirror Array With Hidden Bimorph Actuators and Tip–Tilt-Piston Capability
TL;DR: In this article, a novel high-fill-factor micromirror array (MMA) actuated by electrothermal bimorphs is presented, which can directly be surface mounted onto driving circuit chips or printed circuit boards after fabrication.