For all technologies, from flint arrowheads to DNA microarrays, patterning the functional material is crucial. For semiconductor integrated circuits (ICs), it is even more critical than for most technologies because enormous benefits accrue to going smaller, notably higher speed and much less energy consumed per computing function. The consensus is that ICs will continue to be manufactured until at least the ldquo22 nm noderdquo (the linewidth of an equal line-space pattern). Most patterning of ICs takes place on the wafer in two steps: (a) lithography, the patterning of a resist film on top of the functional material; and (b) transferring the resist pattern into the functional material, usually by etching. Here we concentrate on lithography. Optics has continued to be the chosen lithographic route despite its continually forecast demise. A combination of 193-nm radiation, immersion optics, and computer-intensive resolution enhancement technology will probably be used for the 45- and 32-nm nodes. Optical lithography usually requires that we first make a mask and then project the mask pattern onto a resist-coated wafer. Making a qualified mask, although originally dismissed as a ldquosupport technology,rdquo now represents a significant fraction of the total cost of patterning an IC largely because of the measures needed to push resolution so far beyond the normal limit of optical resolution. Thus, although optics has demonstrated features well below 22 nm, it is not clear that optics will be the most economical in this range; nanometer-scale mechanical printing is a strong contender, extreme ultraviolet is still the official front runner, and electron beam lithography, which has demonstrated minimum features less than 10 nm wide, continues to be developed both for mask making and for directly writing on the wafer (also known as ldquomaskless lithographyrdquo). Going from laboratory demonstration to manufacturing technology is enormously expensive ( $1 billion) and for good reason. Just in terms of data rate (mask pattern to resist pattern), today's exposure tools achieve about 10 Tb/s at an allowable error rate of about 1/h; this data rate will double with each generation. In addition, the edge placement precision required will soon be 30 parts per billion. There are so many opportunities for unacceptable performance that making the right decision goes far beyond understanding the underlying physical principles. But the benefits of continuing to be able to manufacture electronics at the 22-nm node and beyond appear to justify the investment, and there is no shortage of ideas on how to accomplish this.

Lithography and Other Patterning Techniques for Future Electronics

For all technologies, from flint arrowheads to DNA microarrays, patterning the functional material is crucial. For semiconductor integrated circuits (ICs), it is even more critical than for most technologies because enormous benefits accrue to going smaller, notably higher speed and much less energy consumed per computing function. The consensus is that ICs will continue to be manufactured until at least theB22 nm node( (the linewidth of an equal line-space pattern). Most patterning of ICs takes place on the wafer in two steps: a) lithography, the patterning of a resist film on top of the functional material; and b) transferring the resist pattern into the functional material, usually by etching. Here we concentrate on lithography. Optics has continued to be the chosen lithographic route despite its continually forecast demise. A combination of 193-nm radia- tion, immersion optics, and computer-intensive resolution enhancement technology will probably be used for the 45- and 32-nm nodes. Optical lithography usually requires that we first make a mask and then project the mask pattern onto a resist-coated wafer. Making a qualified mask, although origi- nally dismissed as a Bsupport technology,( now represents a significant fraction of the total cost of patterning an IC largely because of the measures needed to push resolution so far beyond the normal limit of optical resolution. Thus, although optics has demonstrated features well below 22 nm, it is not clear that optics will be the most economical in this range; nanometer-scale mechanical printing is a strong contender, extreme ultraviolet is still the official front runner, and electron beam lithography, which has demonstrated minimum features less than 10 nm wide, continues to be developed both for mask making and for directly writing on the wafer (also known as Bmaskless lithography(). Going from laboratory demonstra- tion to manufacturing technology is enormously expensive (9 $1 billion) and for good reason. Just in terms of data rate (mask pattern to resist pattern), today's exposure tools achieve about 10 Tb/s at an allowable error rate of about 1/h; this data rate will double with each generation. In addition, the edge placement precision required will soon be 30 parts per billion. There are so many opportunities for unacceptable perfor- mance that making the right decision goes far beyond under- standing the underlying physical principles. But the benefits of continuing to be able to manufacture electronics at the 22-nm node and beyond appear to justify the investment, and there is no shortage of ideas on how to accomplish this.

/pdf/lithography-and-other-patterning-techniques-for-future-3i6weflsun.pdf

Lithography and Other Patterning Techniques for Future Electronics As integrated circuits continue to go smaller, laying down circuit patterns on semiconductor material becomes more expensive and new techniques are needed.

The invention relates to compositions and methods for decoding microsphere array sensors, and to array compositions comprising at least a first and a second subpopulation of microspheres which are labelled with a different nucleic acid.

Decoding of array sensors with microspheres

Multiple sequential processes are conducted in a reaction chamber to form ultra high quality silicon-containing compound layers, including silicon nitride layers. In a preferred embodiment, a silicon layer is deposited on a substrate using trisilane as the silicon precursor. A silicon nitride layer is then formed by nitriding the silicon layer. By repeating these steps, a silicon nitride layer of a desired thickness is formed.

Method to form ultra high quality silicon-containing compound layers

Embodiments of a dielectric layer containing a hafnium tantalum titanium oxide film structured as one or more monolayers include the dielectric layer disposed in an integrated circuit. Embodiments of methods of fabricating such a dielectric layer provide a dielectric layer for use in a variety of electronic devices. An embodiment may include forming hafnium tantalum titanium oxide film using atomic layer deposition.

Hafnium tantalum titanium oxide films

There are provided a method for fabricating semiconductor nanocrystals which are highly controllable and less variable in density and size, as well as a semiconductor memory device which, with the use of the semiconductor nanocrystals, allows thickness of a insulating film between nanocrystals and channel region to be easily controlled and involves less variations in characteristics such as threshold and programming performance, and which is fast reprogrammable and has nonvolatility. Under a low pressure below atmospheric pressure, an amorphous silicon thin film 3 is deposited on a tunnel insulating film 2 formed on a silicon substrate 1. After the deposition of the amorphous silicon thin film 3, the amorphous silicon thin film 3 is heat treated at a temperature not lower than the deposition temperature of the amorphous silicon thin film 3 in an atmosphere of helium gas having no oxidizability, by which a plurality of spherical nanocrystals 4 with a diameter of 18 nm or less are formed on the tunnel insulating film 2 so as to be spaced from one another. The plurality of nanocrystals 4 are used as the floating gate of a semiconductor memory device.

Method for fabricating semiconductor nanocrystal and semiconductor memory device using the semiconductor nanocrystal

There is provided is a semiconductor storage device that can reduce a dispersion in characteristics such as a threshold voltage and a writing performance and has a low consumption power and a non-volatility. There are included a source region 9 and a drain region 10 formed on a silicon substrate 1, a channel region 3 a located between the source and drain regions 9 and 10, a gate electrode 8 that is formed above the channel region 3 a and controls a channel current flowing through the channel region 3 a, and a control gate insulating film 7, a floating gate 6 and a tunnel insulating film 4 that are arranged in order from the gate electrode 8 side between the channel region 3 a and the gate electrode 8. The floating gate 6 is comprised of a plurality of crystal grains 6 a linearly discretely arranged substantially parallel to the surface of the channel region 3 a.

Semiconductor storage device capable of improving controllability of density and size of floating gate

A quantum dot and quantum fine wire forming method is provided which can allow control of the position for crystalline particle growth and enables formation of particles with high uniformity in size and density and with high reproducibility. After an Si substrate is formed with a step by a dry etching method, an SiO 2 film is formed on the surface of the substrate. The interior of a reaction chamber is evacuated to a vacuum of 10 -8 Torr, and then an Si 2 H 6 gas is introduced into the reaction chamber to flow therein so that Si crystal particles (quantum dots) are formed along the step. The step is formed by conventional photolithography and dry etching; therefore, the position for quantum dot growth can be easily controlled. By controlling the rate and time period of gas flow and the temperature of the substrate it is possible to form quantum fine wires, and to control the size of quantum dots and/or thickness of quantum fine wires. In this way, high uniformity in quantum dot and/or quantum fine wire size/thickness and density can be realized with high reproducibility. Further, low cost production, high yield, and high productivity can be achieved without use of any special fine processing technique.

Method for forming ultrafine particles and/or ultrafine wire, and semiconductor device using ultrafine particles and/or ultrafine wire formed by the forming method

We propose a cell library development methodology for throughput enhancement of character projection equipment. First, an ILP (Integer Linear Programming)-based cell selection is proposed for the equipment for which both of the CP (Character Projection) and VSB (Variable Shaped Beam) methods are available, in order to minimize the number of electron beam (EB) shots, that is, time to fabricate chips. Secondly, the influence of cell directions on area and delay time of chips is examined. The examination helps to reduce the number of EB shots with a little deterioration of area and delay time because unnecessary directions of cells can be removed. Finally, a case study is shown in which the numbers of EB shots are shown for several cases.

Cell Library Development Methodology for Throughput Enhancement of Character Projection Equipment

The character projection is utilized for maskless lithography and is a potential for the future photomask manufacture. The drawback of the character projection is its low throughput and leads to a price rise of ICs. This paper discusses a technology mapping technique for enhancing the throughput of the character projection. The number of EB shots to draw an entire chip determines the fabrication time for the chip. Reduction of the number of EB shots, therefore, increases the throughput of character projection equipment and reduces the cost to produce ICs. Our technology mapping technique aims to reduce the number of EB shots to draw an entire chip for increasing the throughput of character projection equipment. Our technique treats the number of EB shots as an objective to minimize. Comparing with an conventional technology mapping, our technology mapping technique achieved 19.6% reduction of the number of EB shots without any performance degradation of ICs. Moreover, our technology mapping technique achieved 48.8% reduction of the number of EB shots under no performance constraints. Our technique is easy for both IC designers and equipment developers to adopt because it is a software approach with no additional modification on character projection equipment.

Kenta Nakamura

Papers

Method for fabricating semiconductor nanocrystal and semiconductor memory device using the semiconductor nanocrystal

Semiconductor storage device capable of improving controllability of density and size of floating gate

Method for forming ultrafine particles and/or ultrafine wire, and semiconductor device using ultrafine particles and/or ultrafine wire formed by the forming method

Cell Library Development Methodology for Throughput Enhancement of Character Projection Equipment

Technology mapping technique for throughput enhancement of character projection equipment