K
Klaus Werner Stöckelhuber
Researcher at Leibniz Institute for Neurobiology
Publications - 121
Citations - 4128
Klaus Werner Stöckelhuber is an academic researcher from Leibniz Institute for Neurobiology. The author has contributed to research in topics: Natural rubber & Elastomer. The author has an hindex of 32, co-authored 119 publications receiving 3515 citations. Previous affiliations of Klaus Werner Stöckelhuber include Freiberg University of Mining and Technology & Leibniz Association.
Papers
More filters
Journal ArticleDOI
Tribology of thin wetting films between bubble and moving solid surface
TL;DR: This work shows a successful example of coupling of theory and experiment to study the tribology of bubble rubbing on solid surface, and appears to be a step ahead in this area as far as 3D maps of the bubble close to the solid surface are derived.
Journal ArticleDOI
Reactive Blending of Nitrile Butadiene Rubber and In situ Synthesized Thermoplastic Polyurethane-Urea: Novel Preparation Method and Characterization
Muhammad Tahir,Muhammad Tahir,Klaus Werner Stöckelhuber,Nasir Mahmood,Hartmut Komber,Gert Heinrich,Gert Heinrich +6 more
TL;DR: In this paper, an in-situ thermoplastic polyurethane-urea (PUU) was synthesized from the polyaddition of 4,4′-diphenylmethane diisocyanate-terminated prepolymer with Bisaniline-M during blending with NBR in an internal mixer.
Journal ArticleDOI
Surface energetic characterization of nanoscale fillers and elastomers [Oberfächenenergetische charakterisierung von nanoskaligen füllstoffpartikeln und elastomeren]
Journal ArticleDOI
Observations of the stability of wetting films on polymerized LB-layers of tricosa-2,4-diynoic acid
TL;DR: In this article, the authors discussed the possibility of finding a suitable relation between the hydrophobicity of a given surface in terms of the contact angle Θ and the critical thickness hcrit.
Journal ArticleDOI
Effect of deposition inhomogeneity on the Ohm resistance of thin electroless copper layers
TL;DR: In this article, the electric Ohm resistivity ρ of thin electroless Cu layers on glass substrates as a function of deposition thickness is studied, and deviations up to 200 times from the standard resistivity (ρ∞ (Cu) = 1.7 μΩ cm) below 100 nm deposition thickness reported in other papers are confirmed.