Luis J. Matienzo

TL;DR: In this paper, a method of forming a diffusion barrier on an article of a polymer blend of (i) a high surface energy polymer and (ii) a low surface energy polysilicon polymer is presented.

Abstract: A method of making a flip chip package that maintains flatness over a wide temperature range and provides good heat dissipation is described. A laminate substrate is electrically connected to electrical contacts disposed on a chip and underfill material is applied between the soldered connections. A body, for example an uncured dielectric material, is applied to the chip, the laminate substrate, a thermally conductive member or combinations thereof, and thermally conductive member is disposed adjacent to the surface of the chip that is opposite the surface connected to the laminate substrate. The body is extruded between the chip and the thermally conductive member. The thickness of the thermally conductive member is determined by balancing the stiffness and the CTE of both the thermally conductive member and the laminate substrate, and the length and width of the thermally conductive member may vary but are at least the size of the corresponding length and width of the chip.

TL;DR: In this article, the results of surface analysis and modification with vacuum ultraviolet (VUV) irradiation of Teflon-AF•2400 using contact angle measurements, x-ray photoelectron spectroscopy (XPS), and laser assisted Fourier transform (FTMS) were compared to those for other, more crystalline, fluoropolymers.

TL;DR: The lower energy signal of the neat films to solvent ligation, and the higher energy peak is attributed to interactions between the porphyrins and conjugated bridges on nearby polymer chains, successfully applied to the N 1s XPS data from a previously reported Zn-porphyrin oligomer-based multilayer array.