Low temperature plasmas (LTPs) enable to create a highly reactive environment at near ambient temperatures due to the energetic electrons with typical kinetic energies in the range of 1 to 10 eV (1 eV = 11600K), which are being used in applications ranging from plasma etching of electronic chips and additive manufacturing to plasma-assisted combustion. LTPs are at the core of many advanced technologies. Without LTPs, many of the conveniences of modern society would simply not exist. New applications of LTPs are continuously being proposed. Researchers are facing many grand challenges before these new applications can be translated to practice. In this paper, we will discuss the challenges being faced in the field of LTPs, in particular for atmospheric pressure plasmas, with a focus on health, energy and sustainability. 

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Grand challenges in low temperature plasmas

This article discusses key elementary surface-reaction processes in state-of-the-art plasma etching and deposition relevant to nanoelectronic device fabrication and presents a concise guide to the forefront of research on plasma-enhanced atomic layer etching (PE-ALE) and plasma-enhanced atomic layer deposition (PE-ALD). As the critical dimensions of semiconductor devices approach the atomic scale, atomic-level precision is required in plasma processing. The development of advanced plasma processes with such accuracy necessitates an in-depth understanding of the surface reaction mechanisms. With this in mind, we first review the basics of reactive ion etching (RIE) and high-aspect-ratio (HAR) etching and we elaborate on the methods of PE-ALE and PE-ALD as surface-controlled processing, as opposed to the conventional flux-controlled processing such as RIE and chemical vapor deposition (CVD). Second, we discuss the surface reaction mechanisms of PE-ALE and PE-ALD and the roles played by incident ions and radicals in their reactions. More specifically, we discuss the role of transport of ions and radicals, including their surface reaction probabilities and ion-energy-dependent threshold effects in processing over HAR features such as deep holes and trenches.

Foundations of atomic-level plasma processing in nanoelectronics

Low-temperature plasma-processing technologies are essential for material synthesis and device fabrication. Not only the utilization but also the development of plasma-related products and services requires an understanding of the multiscale hierarchies of complex behaviors of plasma-related phenomena, including plasma generation in physics and chemistry, transport of energy and mass through the sheath region, and morphology- and geometry-dependent surface reactions. Low-temperature plasma science and technology play a pivotal role in the exploration of new applications and in the development and control of plasma-processing methods. Presently, science-based and data-driven approaches to control systems are progressing with the state-of-the-art deep learning, machine learning, and artificial intelligence. In this review, researchers in material science and plasma processing, review and discuss the requirements and challenges of research and development in these fields. In particular, the prediction of plasma parameters and the discovery of processing recipes are asserted by outlining the emerging science-based, data-driven approaches, which are called plasma informatics.

https://iopscience.iop.org/article/10.35848/1347-4065/ac9189/pdf

Science-based, data-driven developments in plasma processing for material synthesis and device-integration technologies

Plasma-based nitrogen fixation for fertilizer production is an attractive alternative to the fossil fuel-based industrial processes. However, many factors hinder its applicability, e.g., the commonly observed inverse correlation between energy consumption and production rates or the necessity to enhance the selectivity toward NO2, the desired product for a more facile formation of nitrate-based fertilizers. In this work, we investigated the use of a rotating gliding arc plasma for nitrogen fixation at elevated pressures (up to 3 barg), at different feed gas flow rates and composition. Our results demonstrate a dramatic increase in the amount of NOx produced as a function of increasing pressure, with a record-low EC of 1.8 MJ/(mol N) while yielding a high production rate of 69 g/h and a high selectivity (94%) of NO2. We ascribe this improvement to the enhanced thermal Zeldovich mechanism and an increased rate of NO oxidation compared to the back reaction of NO with atomic oxygen, due to the elevated pressure. 

Nitrogen Fixation by an Arc Plasma at Elevated Pressure to Increase the Energy Efficiency and Production Rate of NOx

Low temperature plasma-assisted synthesis and modification of water splitting electrocatalysts

The 2022 Roadmap is the next update in the series of Plasma Roadmaps published by Journal of Physics D with the intent to identify important outstanding challenges in the field of low-temperature plasma (LTP) physics and technology. The format of the Roadmap is the same as the previous Roadmaps representing the visions of 41 leading experts representing 21 countries and five continents in the various sub-fields of LTP science and technology. In recognition of the evolution in the field, several new topics have been introduced or given more prominence. These new topics and emphasis highlight increased interests in plasma-enabled additive manufacturing, soft materials, electrification of chemical conversions, plasma propulsion, extreme plasma regimes, plasmas in hypersonics, data-driven plasma science and technology and the contribution of LTP to combat COVID-19. In the last few decades, LTP science and technology has made a tremendously positive impact on our society. It is our hope that this roadmap will help continue this excellent track record over the next 5–10 years.

M. Šimek

Papers

The 2022 Plasma Roadmap: low temperature plasma science and technology