https://iopscience.iop.org/article/10.1088/1468-6996/11/4/044305/pdf

Present status of amorphous In–Ga–Zn–O thin-film transistors

Gallium oxide (Ga2O3) is emerging as a viable candidate for certain classes of power electronics, solar blind UV photodetectors, solar cells, and sensors with capabilities beyond existing technologies due to its large bandgap. It is usually reported that there are five different polymorphs of Ga2O3, namely, the monoclinic (β-Ga2O3), rhombohedral (α), defective spinel (γ), cubic (δ), or orthorhombic (e) structures. Of these, the β-polymorph is the stable form under normal conditions and has been the most widely studied and utilized. Since melt growth techniques can be used to grow bulk crystals of β-GaO3, the cost of producing larger area, uniform substrates is potentially lower compared to the vapor growth techniques used to manufacture bulk crystals of GaN and SiC. The performance of technologically important high voltage rectifiers and enhancement-mode Metal-Oxide Field Effect Transistors benefit from the larger critical electric field of β-Ga2O3 relative to either SiC or GaN. However, the absence of clear demonstrations of p-type doping in Ga2O3, which may be a fundamental issue resulting from the band structure, makes it very difficult to simultaneously achieve low turn-on voltages and ultra-high breakdown. The purpose of this review is to summarize recent advances in the growth, processing, and device performance of the most widely studied polymorph, β-Ga2O3. The role of defects and impurities on the transport and optical properties of bulk, epitaxial, and nanostructures material, the difficulty in p-type doping, and the development of processing techniques like etching, contact formation, dielectrics for gate formation, and passivation are discussed. Areas where continued development is needed to fully exploit the properties of Ga2O3 are identified.

A review of Ga2O3 materials, processing, and devices

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

Semiconductor device and display device

Optical transparency, tunable conducting properties and easy processability make metal oxides key materials for advanced optoelectronic devices. This Review discusses recent advances in the synthesis of these materials and their use in applications. Metal oxides (MOs) are the most abundant materials in the Earth's crust and are ingredients in traditional ceramics. MO semiconductors are strikingly different from conventional inorganic semiconductors such as silicon and III–V compounds with respect to materials design concepts, electronic structure, charge transport mechanisms, defect states, thin-film processing and optoelectronic properties, thereby enabling both conventional and completely new functions. Recently, remarkable advances in MO semiconductors for electronics have been achieved, including the discovery and characterization of new transparent conducting oxides, realization of p-type along with traditional n-type MO semiconductors for transistors, p–n junctions and complementary circuits, formulations for printing MO electronics and, most importantly, commercialization of amorphous oxide semiconductors for flat panel displays. This Review surveys the uniqueness and universality of MOs versus other unconventional electronic materials in terms of materials chemistry and physics, electronic characteristics, thin-film fabrication strategies and selected applications in thin-film transistors, solar cells, diodes and memories.

Metal oxides for optoelectronic applications

— High-performance top-gate thin-film transistors (TFTs) with a transparent zinc oxide (ZnO) channel have been developed. ZnO thin films used as active channels were deposited by rf magnetron sputtering. The electrical properties and thermal stability of the ZnO films are controlled by the deposition conditions. A gate insulator made of silicon nitride (SiNx) was deposited on the ZnO films by conventional P-CVD. A novel ZnO-TFT process based on photolithography is proposed for AMLCDs. AMLCDs having an aperture ratio and pixel density comparable to those of a-Si:H TFT-LCDs are driven by ZnO TFTs using the same driving scheme of conventional AMLCDs.

Novel top‐gate zinc oxide thin‐film transistors (ZnO TFTs) for AMLCDs

A semiconductor device includes an oxide semiconductor thin film layer primarily including zinc oxide having at least one orientation other than (002) orientation. The zinc oxide may have a mixed orientation including (002) orientation and (101) orientation. Alternatively, the zinc oxide may have a mixed orientation including (100) orientation and (101) orientation.

Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof

In this paper, high-performance bottom-gate thin-film transistors (TFTs) with transparent zinc oxide (ZnO) channels have been developed. The ZnO film for active channels was deposited by RF magnetron sputtering. The crystallinity of the ZnO film drastically improved when it was deposited on a doublelayer SiOx/SiNx gate insulator. In order to achieve a ZnO TFT back-plane for liquid-crystal display (LCD) with the required pattern accuracy, dry etching of the ZnO film in an Ar and CH4 chemistry has been developed. The etching rate and tapered profile of the ZnO film could be controlled by the Ar content in the etching gases of Ar and CH4. The saturation mobility (musat) of the ZnO TFT strongly depended on a gate voltage. A musat of 5.2 & cm2 .(V .s)-1 at VGS = 40 V and VDS = 10 V, and an on/off-current ratio of 2.7 x 107 were obtained. A drain-current uniformity of plusmn7% was achieved within a radius of 20 mm from the substrate center. A 1.46 -in diagonal LCD with 61 600 pixels has been driven by the ZnO-TFT back-plane. A moving picture image was available on fabricated LCD driven by the ZnO TFTs.

Bottom-Gate Zinc Oxide Thin-Film Transistors (ZnO TFTs) for AM-LCDs

A method for forming a polycrystalline semiconductor thin film according to the present invention includes the steps of: forming a semiconductor thin film partially containing microcrystals serving as crystal nuclei for polycrystallization on an insulating substrate; and polycrystallizing the semiconductor thin film by laser annealing.

Method for forming polycrystalline thin film and method for fabricating thin-film transistor

Highly crystalline α-phase gallium oxide (Ga2O3) thin films were grown by fine-channel mist chemical vapor deposition on c-sapphire substrates at 400 °C at a deposition rate of more than 20 nm/min. The thin films were doped with Sn(IV) atoms, which were obtained from Sn(II) chloride by the reaction SnCl2+ H2O2+ 2HCl→SnCl4+ 2H2O. Conductive α-phase Ga2O3 thin films were successfully grown from source solutions containing less than 10 at. % Sn(IV). The source solution containing 4 at. % Sn(IV) resulted in obtaining a thin film with an n-type conductivity as high as 0.28 S cm-1, a mobility of 0.23 cm2 V-1 s-1, a carrier concentration of 7×1018 cm-3, and a full width at half maximum (FWHM) of the (0006) reflection X-ray rocking curve as low as 64 arcsec.

https://iopscience.iop.org/article/10.1143/JJAP.51.040207/pdf

Mamoru Furuta

Papers

Novel top‐gate zinc oxide thin‐film transistors (ZnO TFTs) for AMLCDs

Semiconductor device including active layer made of zinc oxide with controlled orientations and manufacturing method thereof

Bottom-Gate Zinc Oxide Thin-Film Transistors (ZnO TFTs) for AM-LCDs

Method for forming polycrystalline thin film and method for fabricating thin-film transistor

Successful Growth of Conductive Highly Crystalline Sn-Doped ?-Ga2O3 Thin Films by Fine-Channel Mist Chemical Vapor Deposition