During the last few years the developments in the field of III–nitrides have been spectacular. High quality epitaxial layers can now be grown by MOVPE. Recently good quality epilayers have also been grown by MBE. Considerable work has been done on dislocations, strain, and critical thickness of GaN grown on different substrates. Splitting of valence band by crystal field and by spin-orbit interaction has been calculated and measured. The measured values agree with the calculated values. Effects of strain on the splitting of the valence band and on the optical properties have been studied in detail. Values of band offsets at the heterointerface between several pairs of different nitrides have been determined. Extensive work has been done on the optical and electrical properties. Near band-edge spectra have been measured over a wide range of temperatures. Free and bound exciton peaks have been resolved. Valence band structure has been determined using the PL spectra and compared with the theoretically calcu...

III–nitrides: Growth, characterization, and properties

Transient electron transport and velocity overshoot in wurtzite GaN, InN, and AlN are examined and compared with that which occurs in GaAs. For all materials, we find that electron velocity overshoot only occurs when the electric field is increased to a value above a certain critical field, unique to each material. This critical field is strongly dependent on the material, about 4 kV/cm for the case of GaAs but much higher for the III–nitride semiconductors: 140 kV/cm for GaN, 65 kV/cm for InN, and 450 kV/cm for AlN. We find that InN exhibits the highest peak overshoot velocity and that this velocity overshoot lasts over the longest distances when compared with GaN and AlN. Finally, using a one-dimensional energy–momentum balance approach, a simple model is used to estimate the cutoff frequency performance of nitride based heterojunction field effect transistors (HFETs) and a comparison is made to recently fabricated AlGaN/GaN HFETs.

Transient electron transport in wurtzite GaN, InN, and AlN

GaN and related materials (especially AlGaN) have recently attracted a lot of interest for applications in high power electronics capable of operation at elevated temperatures. Although the growth and processing technology for SiC, the other viable wide bandgap semiconductor material, is more mature, the AlGaInN system offers numerous advantages. These include wider bandgaps, good transport properties, the availability of heterostructures (particularly AlGaN/GaN), the experience base gained by the commercialization of GaN-based laser and light-emitting diodes and the existence of a high growth rate epitaxial method (hydride vapor phase epitaxy) for producing very thick layers or even quasi-substrates. These attributes have led to rapid progress in the realization of a broad range of GaN electronic devices, including heterostructure field effect transistors (HFETs), Schottky and p–i–n rectifiers, heterojunction bipolar transistors (HBTs), bipolar junction transistors (BJTs) and metal-oxide semiconductor field effect transistors (MOSFETs). This review focuses on the development of fabrication processes for these devices and the current state-of-the-art in device performance, for all of these structures. We also detail areas where more work is needed, such as reducing defect densities and purity of epitaxial layers, the need for substrates and improved oxides and insulators, improved p-type doping and contacts and an understanding of the basic growth mechanisms.

Fabrication and performance of GaN electronic devices

We present a comprehensive study of the transport dynamics of electrons in the ternary compounds, Al/sub x/Ga/sub 1-x/N and In/sub x/Ga/sub 1-x/N. Calculations are made using a nonparabolic effective mass energy band model. Monte Carlo simulation that includes all of the major scattering mechanisms. The band parameters used in the simulation are extracted from optimized pseudopotential band calculations to ensure excellent agreement with experimental information and ab initio band models. The effects of alloy scattering on the electron transport physics are examined. The steady state velocity field curves and low field mobilities are calculated for representative compositions of these alloys at different temperatures and ionized impurity concentrations. A field dependent mobility model is provided for both ternary compounds AlGaN and InGaN. The parameters for the low and high field mobility models for these ternary compounds are extracted and presented. The mobility models can be employed in simulations of devices that incorporate the ternary III-nitrides.

Monte Carlo simulation of electron transport in the III-nitride wurtzite phase materials system: binaries and ternaries

There is a great interest in wide-bandgap semiconductor devices and most recently in monolithic GaN structures for power electronics applications. In this paper, vertical p-n diodes fabricated on pseudobulk low defect density ( $10^{4}$ – $10^{6}$ cm $^{-2}$ ) GaN substrates are discussed. Homoepitaxial low-pressure metal organic chemical vapor deposition growth of GaN on its native substrate and being able to control and balance the n-type Si doping with background C impurity has allowed the realization of vertical device architectures with drift layer thicknesses of 6 to 40 $\mu $ m and net carrier electron concentrations of $4\times 10^{15}$ to $2.5\times 10^{16}$ cm $^{-3}$ . This parameter range is suitable for applications requiring breakdown voltages (BVs) of 600 V–4 kV with a proper edge termination strategy. Measured devices demonstrate near power device figure of merit, that is, differential specific on-resistance ( $R_{{{\textrm {sp}}}}$ ) of 2 m $\Omega $ cm $^{2}$ for a BV of 2.6 kV and 2.95 m $\Omega $ cm $^{2}$ for a 3.7-kV device, respectively. The improvement in the substrate quality over the last few years has resulted in the fabrication of diodes with areas as large as 16 mm $^{2}$ , with BVs exceeding 700 V and pulsed (100 $\mu $ s) currents of 400 A. The structures fabricated are utilized to study in detail the temperature dependency of $I$ – $V$ characteristics, impact ionization and avalanche characteristics, and extract (estimate) modeling parameters such as electron mobility in the GaN $c$ -direction (vertical) and hole minority carrier lifetimes. Some insight into device reliability is also provided.

Vertical Power p-n Diodes Based on Bulk GaN

The output characteristics, cutoff frequency, breakdown voltage and the transconductance of wurtzite and zincblende phase GaN MESFETs have been calculated using a self-consistent, full band Monte Carlo simulation. It is found that the calculated breakdown voltage for the wurtzite device is considerably higher than that calculated for a comparable GaN zincblende phase device. The zincblende device is calculated to have a higher transconductance and cutoff frequency than the wurtzite device. The higher breakdown voltage of the wurtzite phase device is attributed to the higher density of electronic states for this phase compared to the zincblende phase. The higher cutoff frequency and transconductance of the zincblende phase GaN device is attributed to more appreciable electron velocity overshoot for this phase compared to that for the wurtzite phase. The maximum cutoff frequency and transconductance of a 0.1 μm gate-length zincblende GaN MESFET are calculated to be 220GHz and 210 mS/mm, respectively. The corresponding quantities for the wurtzite GaN device are calculated to be 160GHz and 158 mS/mm.

Maziar Farahmand

Papers

Full Band Monte Carlo Comparison of Wurtzite and Zincblende Phase GaN MESFETs