We survey progress over the past 25 years in the development of microscale devices for pumping fluids. We attempt to provide both a reference for micropump researchers and a resource for those outside the field who wish to identify the best micropump for a particular application. Reciprocating displacement micropumps have been the subject of extensive research in both academia and the private sector and have been produced with a wide range of actuators, valve configurations and materials. Aperiodic displacement micropumps based on mechanisms such as localized phase change have been shown to be suitable for specialized applications. Electroosmotic micropumps exhibit favorable scaling and are promising for a variety of applications requiring high flow rates and pressures. Dynamic micropumps based on electrohydrodynamic and magnetohydrodynamic effects have also been developed. Much progress has been made, but with micropumps suitable for important applications still not available, this remains a fertile area for future research.

https://microfluidics.stanford.edu/Publications/Micropumps_Cooling/Laser%20Review%20of%20Micropumps%20in%20JMM.pdf

A review of micropumps

Gallium oxide (Ga2O3) is emerging as a viable candidate for certain classes of power electronics, solar blind UV photodetectors, solar cells, and sensors with capabilities beyond existing technologies due to its large bandgap. It is usually reported that there are five different polymorphs of Ga2O3, namely, the monoclinic (β-Ga2O3), rhombohedral (α), defective spinel (γ), cubic (δ), or orthorhombic (e) structures. Of these, the β-polymorph is the stable form under normal conditions and has been the most widely studied and utilized. Since melt growth techniques can be used to grow bulk crystals of β-GaO3, the cost of producing larger area, uniform substrates is potentially lower compared to the vapor growth techniques used to manufacture bulk crystals of GaN and SiC. The performance of technologically important high voltage rectifiers and enhancement-mode Metal-Oxide Field Effect Transistors benefit from the larger critical electric field of β-Ga2O3 relative to either SiC or GaN. However, the absence of clear demonstrations of p-type doping in Ga2O3, which may be a fundamental issue resulting from the band structure, makes it very difficult to simultaneously achieve low turn-on voltages and ultra-high breakdown. The purpose of this review is to summarize recent advances in the growth, processing, and device performance of the most widely studied polymorph, β-Ga2O3. The role of defects and impurities on the transport and optical properties of bulk, epitaxial, and nanostructures material, the difficulty in p-type doping, and the development of processing techniques like etching, contact formation, dielectrics for gate formation, and passivation are discussed. Areas where continued development is needed to fully exploit the properties of Ga2O3 are identified.

A review of Ga2O3 materials, processing, and devices

Data centers are critical, energy-hungry infrastructures that run large-scale Internet-based services. Energy consumption models are pivotal in designing and optimizing energy-efficient operations to curb excessive energy consumption in data centers. In this paper, we survey the state-of-the-art techniques used for energy consumption modeling and prediction for data centers and their components. We conduct an in-depth study of the existing literature on data center power modeling, covering more than 200 models. We organize these models in a hierarchical structure with two main branches focusing on hardware-centric and software-centric power models. Under hardware-centric approaches we start from the digital circuit level and move on to describe higher-level energy consumption models at the hardware component level, server level, data center level, and finally systems of systems level. Under the software-centric approaches we investigate power models developed for operating systems, virtual machines and software applications. This systematic approach allows us to identify multiple issues prevalent in power modeling of different levels of data center systems, including: i) few modeling efforts targeted at power consumption of the entire data center ii) many state-of-the-art power models are based on a few CPU or server metrics, and iii) the effectiveness and accuracy of these power models remain open questions. Based on these observations, we conclude the survey by describing key challenges for future research on constructing effective and accurate data center power models.

Data Center Energy Consumption Modeling: A Survey

https://www.sfu.ca/~mbahrami/ENSC%20461/Project/Some%20papers%20for%20CO2%20Ref/Fundamental%20process%20and%20system%20design%20issues%20in%20CO2%20vapor%20compression%20systems.pdf

Fundamental process and system design issues in CO2 vapor compression systems

Microscale combustion: Technology development and fundamental research

Applications of Micro and Nano Technologies in the Oil and Gas Industry - Overview of the Recent Progress

The inexorable rise in chip power dissipation and emergence of on-chip hot spots with heat fluxes approaching 1 =kW/cm2 has turned renewed attention to direct cooling with dielectric liquids. Use of dielectric liquids in intimate contact with the heat dissipating surfaces eliminates the deleterious effects of solid-solid interface resistances and harnesses the highly efficient phase-change processes to the critical thermal management of advanced IC chips. In the interest of defining the state-of-the-art in direct liquid cooling, this paper begins with a discussion of the thermophysics of phase-change processes and a description of the available dielectric liquid cooling techniques and their history. It then describes the phenomenology of pool boiling, spray/jet impingement, gas-assisted evaporation, and synthetic jet impingement with dielectric liquids. Available correlations for predicting the heat transfer coefficients and limiting heat transfer rates, as well as documented empirical results for these promising techniques for on-chip hot spot cooling, are also provided and compared

Direct Liquid Cooling of High Flux Micro and Nano Electronic Components

This paper presents the design, fabrication, and characterization of an innovative microcooling device for microelectronics applications. The device incorporates an active evaporative cooling surface, a polarization micropump, and temperature sensors into a single chip. The micropump provides the required pumping action to bring the working fluid to the evaporating surface, allowing the effective heat transfer coefficient through a thin-film evaporation/boiling process. The device is based on VLSI microfabrication technology, allowing the electrohydrodynamic (EHD) electrodes to be integrated directly onto the cooling surface. Since the EHD electrodes are fabricated using the same technology as the electronic systems themselves, the proposed microelectronic cooling system in the form of an integrated microchip is very suitable for mass production. The prototype devices demonstrated a maximum cooling capacity of 65 W/cm/sup 2/ with a corresponding pumping head of 250 Pa. The results of this investigation will assist in the development of future microcooling devices capable of operating at high power levels.

An electrohydrodynamic polarization micropump for electronic cooling

This paper presents the design, fabrication, and testing of a novel electrohydrodynamic (EHD) ion-drag micropump. In order to maximize the electrical field gradients that are responsible for EHD pumping, we incorporated three-dimensional (3-D) triangular bumps of solder as part of the EHD electrodes. To form these bumps, Niobium was sputter-deposited onto a ceramic substrate, coated with photoresist, optically exposed and etched using a reactive ion etcher to define the electrode pattern. The substrate was then "dipped" into a molten solder pool. Since the solder adheres only to the metallic film, bumps of solder form on the electrodes, giving the electrodes a significant 3-D character. The overall dimensions of the micropump are 19 mm /spl times/ 32 mm /spl times/ 1.05 mm. Four different designs were fabricated and tested. Static pressure tests were performed with a 3M Thermal Fluid (HFE-7100) as the working fluid and the optimum design was identified. The results with the thermal fluid were highly promising and indicated a pumping head of up to 700 Pa at an applied voltage of 300 V. The experimental results for the four different designs show that the presence of the 3-D bump structures significantly improves the pumping performance. Also, a much better pumping performance was obtained with the micropump in which the emitter had a saw-tooth shape.

/pdf/design-fabrication-and-testing-of-an-electrohydrodynamic-ion-1o09zijkof.pdf

Michael M. Ohadi

Papers

Applications of Micro and Nano Technologies in the Oil and Gas Industry - Overview of the Recent Progress

Direct Liquid Cooling of High Flux Micro and Nano Electronic Components

An electrohydrodynamic polarization micropump for electronic cooling

Design, fabrication, and testing of an electrohydrodynamic ion-drag micropump

Measurement of solar energy radiation in Abu Dhabi, UAE