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Michael Pecht

Researcher at University of Maryland, College Park

Publications -  1194
Citations -  38587

Michael Pecht is an academic researcher from University of Maryland, College Park. The author has contributed to research in topics: Prognostics & Reliability (statistics). The author has an hindex of 78, co-authored 1131 publications receiving 29099 citations. Previous affiliations of Michael Pecht include City University of Hong Kong & American Society of Mechanical Engineers.

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Proceedings ArticleDOI

A Bayesian Hidden Markov Model-based approach for anomaly detection in electronic systems

TL;DR: An application of the developed Bayesian Hidden Markov Model-based anomaly detection approach is presented for detecting anomalous behavior in Insulated Gate Bipolar Transistors using experimental data, and results illustrate that the development can help detect anomalous behaviors in electronic systems, which can help prevent system downtime and catastrophic failures.
Journal ArticleDOI

Plastic packaged microcircuits: quality, reliability, and cost issues

TL;DR: In this article, a survey of PEM packaging with respect to the issues of reliability, market lead-time, performance, cost, and weight as a means to guide part selection and system design is presented.
Journal ArticleDOI

Measurement of the hygroscopic swelling coefficient in mold compounds using moiré interferometry

Abstract: An experimental method is proposed to characterize the hygroscopic swelling of mold compounds. The method utilizes moire interferometry, which measures in-plane displacements over a relatively large gage length with submicron measurement sensitivity. Deformations caused by the absorption of moisture in mold compounds are analyzed to determine the coefficient of hygroscopic swelling (CHS). The large gage length nullifies the pointto-point variation within the sample, and the high sensitivity provides the measurement accuracy required for the small hygroscopic deformation. Representative results obtained from a commercially available mold compound are presented.
Journal ArticleDOI

Characterization of polyimides used in high density interconnects

TL;DR: In this paper, the failure mechanisms of Kapton and ULTEM polyimide films in tensile tests are discussed and compared with the failure mechanism of polyimides used in high-density interconnects.
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A Deep Forest-Based Fault Diagnosis Scheme for Electronics-Rich Analog Circuit Systems

TL;DR: An improved DF algorithm based on nonparametric predictive inference (NPI) is proposed, named NPIDF, which can better deal with small sample data, and achieves good diagnosis effect and performance is better, showing a greater advantage in small sampleData.