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Nobuo Ogura
Researcher at Georgia Institute of Technology
Publications - 3
Citations - 17
Nobuo Ogura is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Epoxy & Integrated circuit packaging. The author has an hindex of 2, co-authored 3 publications receiving 7 citations.
Papers
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Journal ArticleDOI
Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration
Yiteng Wang,Atom Watanabe,Nobuo Ogura,Pulugurtha Markondeya Raj,Pulugurtha Markondeya Raj,Rao Tummala +5 more
TL;DR: In this article, a two-particle sintering theory is proposed to describe the neck growth evolution of copper paste at the initial stage of sinting, and the neck-growth model shows good consistency with the measured neck size of copper.
Proceedings ArticleDOI
Low-Loss Additively-Deposited Ultra-Short Copper-Paste Interconnections in 3D Antenna-Integrated Packages for 5G and IoT Applications
Atom Watanabe,Yiteng Wang,Nobuo Ogura,P. Markondeya Raj,Vanessa Smet,Manos M. Tentzeris,Rao Tummala +6 more
TL;DR: In this paper, a nanocopper interconnection with ultra-low interconnect losses for chip-last or flip-chip assembly in packages is presented. But the authors focus on the material syntheses and process development of nanocoppers interconnections.
Journal ArticleDOI
First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications
Nobuo Ogura,Siddharth Ravichandran,Tailong Shi,Atom Watanabe,Shuhei Yamada,Shuhei Yamada,Mohanalingam Kathaperumal,Rao Tummala +7 more
TL;DR: With the number of connected devices increasing tremendously, communication data rates are projected to be at least 10-100X in the 5G/mm-wave (MMW) technology.