Journal ArticleDOI
First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications
Nobuo Ogura,Siddharth Ravichandran,Tailong Shi,Atom Watanabe,Shuhei Yamada,Shuhei Yamada,Mohanalingam Kathaperumal,Rao Tummala +7 more
- Vol. 2019, Iss: 1
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TLDR
With the number of connected devices increasing tremendously, communication data rates are projected to be at least 10-100X in the 5G/mm-wave (MMW) technology.Abstract:
With the number of connected-devices increasing tremendously, communication data rates are projected to be at least 10–100X in the 5G/mm-wave (MMW) technology - much higher than the existi...read more
Citations
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Journal ArticleDOI
A Review of 5G Front-End Systems Package Integration
TL;DR: In this paper, the key building blocks of 5G systems and the underlying advances in packaging technologies to realize them are reviewed and a 3D ultrathin packages with higher component densities and performance than with the existing 2D packages is presented.
Proceedings ArticleDOI
Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications
Atom Watanabe,Muhammad Ali,Rui Zhang,Siddharth Ravichandran,Takenori Kakutani,P. Markondeya Raj,Rao Tummala,Madhavan Swaminathan +7 more
TL;DR: This paper focuses on reduced chip-to-package losses and implementation of filters and antennas with chip-embedding structures in glass substrates and the benefits of glass-panel embedding (GPE) for 5G communications.
Book ChapterDOI
Fan-Out Wafer/Panel-Level Packaging
TL;DR: First of all, both fan-in wafer/panel-level chip-scale packages (W/PLCSPs or simply WLCSP).
Book ChapterDOI
State-Of-The-Art of Advanced Packaging
TL;DR: In this article , the kinds of advanced packaging are ranked based on their interconnect density and electrical performance, and are grouped into 2D, 2.1D and 3D IC integration.
References
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Journal ArticleDOI
Compact 60 GHz Phased-Array Antennas With Enhanced Radiation Properties in Flip-Chip BGA Packages
TL;DR: In this article, a compact phased-array antenna embedded in flip-chip ball grid array (BGA) packages is proposed to operate over the unlicensed 60 GHz frequency band.
Proceedings ArticleDOI
2.5D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages
Siddharth Ravichandran,Shuhei Yamada,Giback Park,Chen Han-Wen,Tailong Shi,Chintan Buch,Fuhan Liu,Vanessa Smet,Venky Sundaram,Rao Tummala +9 more
TL;DR: In this article, the authors demonstrate a 2.5D glass panel embedding (GPE) architecture with better I/O density, performance, cost and reliability than silicon interposers and high density fan-out packages for heterogeneous integration.
Proceedings ArticleDOI
Comprehensive Investigation of Die Shift in Compression Molding Process for 12 Inch Fan-Out Wafer Level Packaging
TL;DR: In this paper, a comprehensive investigation has been performed using the developed multi-step simulation scheme to capture the die shift variation during the compression molding process for fan-out wafer level packaging (FOWLP).
Proceedings ArticleDOI
Leading-Edge and Ultra-Thin 3D Glass-Polymer 5G Modules with Seamless Antenna-to-Transceiver Signal Transmissions
Atom Watanabe,Tong-Hong Lin,P. Markondeya Raj,Venky Sundaram,Manos M. Tentzeris,Rao Tummala,Tomonori Ogawa +6 more
TL;DR: In this paper, the authors demonstrate seamless antenna-to-transceiver signal transitions on panel-scale processed ultra-thin glass-based 5G modules with impedance-matched transmission lines and microvias with high-precision low-loss re-distribution layer design and fabrication, for high-speed 5G communication standards at the 28 GHz band.
Proceedings ArticleDOI
Nanostructured miniaturized artificial magnetic conductors (AMC) for high-performance antennas in 5G, IoT, and smart skin applications
TL;DR: In this article, novel miniaturized nanostructured AMCs utilizing Barium Strontium Titanate (BST) thinfilms and ceramic-polymer composites are demonstrated through full-wave modeling analysis.