Ram S. Viswanath

TL;DR: In this paper, an apparatus and method for controlling the temperature of a heat generating device is described. Butler et al. present a pickup chuck with a heat pipe, which includes a first end defining an evaporator portion and a second end defining a condenser portion.

TL;DR: In this paper, the authors proposed a heat sink for cooling and electronic devices. The heat sink includes a member, and a heat pipe secured to the member, the member has a first, evaporator section and a second, condenser section.

TL;DR: This article provides an overview of the embedded multidie interconnect bridge (EMIB) multichip packaging (MCP) technology, a unique packaging paradigm that provides very high-density interconnects localized in between two devices, thus enabling high-bandwidth (BW) on-package links while leaving the rest of the package structures and designs unaffected.

TL;DR: A pickup chuck having a heat slug for removing heat from a heat generating device that was held within the pickup chuck is described in this article, where the slug is attached to the pickup.

TL;DR: In this article, a component manufacturer and a thermal analysis software vendor working together to construct and validate a thermal model of first-level packaging of a die (the Pentium processor) are presented.