Ravi Mahajan

TL;DR: This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.

TL;DR: The EMIB dense MCP technology is a new packaging paradigm that provides localized high density interconnects between two or more die on an organic package substrate, opening up new opportunities for heterogeneous on-package integration.

TL;DR: In this paper, thermal design power trends and power densities for present and future single-core microprocessors are derived based on Moore's law and scaling theory, both active and stand-by power are discussed and accounted for in the calculations.

TL;DR: A flip chip integrated circuit (FLIC) as discussed by the authors provides stress relief for the solder bumps of the package by leaving an area that is located between the layers and adjacent to the bond pads, allowing the integrated circuit to expand at a different rate than the substrate when the package is thermally cycled.

TL;DR: The Thermal Challenges in Next Generation Electronic Systems (THERMES) workshop as discussed by the authors focused on thermal management roadmaps, micro-scale cooling systems, numerical modeling from the component to system levels, hardware for future high performance and Internet computing architectures, and transport issues in the manufacturing of electronic packages.