Showing papers by "Rao Tummala published in 1989"
IBM1
TL;DR: A broad review of ceramics in microelectronics for processing, storing, transferring, printing, and displaying information is highlighted in this article, with a review of the history, evolution, and state of the art.
Abstract: A broad review of ceramics in microelectronics for processing, storing, transferring, printing, and displaying information is highlighted. Ceramic packaging is presented with a review of the history, evolution, and state of the art. The recent developments in ceramics resulting in potentially improved thermal and electrical properties by the use of SiC, AIN, and glass±ceramics are discussed. The scientific understanding necessary to support these developments is mentioned.
3 citations