R
Risto Kurppa
Researcher at University of Helsinki
Publications - 11
Citations - 234
Risto Kurppa is an academic researcher from University of Helsinki. The author has contributed to research in topics: Wire bonding & Electric sail. The author has an hindex of 4, co-authored 11 publications receiving 207 citations. Previous affiliations of Risto Kurppa include Finnish Meteorological Institute.
Papers
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Journal ArticleDOI
Invited Article: Electric solar wind sail: Toward test missions
Pekka Janhunen,Petri Toivanen,Jouni Polkko,S. Merikallio,Pekka Salminen,Edward Hæggström,Henri Seppänen,Risto Kurppa,Jukka Ukkonen,S.K. Kiprich,Greger Thornell,Henrik Kratz,Lutz Richter,Olaf Krömer,Roland Rosta,Mart Noorma,Jouni Envall,S. Lätt,Giovanni Mengali,Alessandro Antonio Quarta,H. Koivisto,Olli Tarvainen,Taneli Kalvas,J. Kauppinen,Antti Nuottajärvi,Alexander N. Obraztsov +25 more
TL;DR: A review of the ongoing technical development work of the E-sail is given, covering tether construction, overall mechanical design alternatives, guidance and navigation strategies, and dynamical and orbital simulations.
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Wire-to-wire bonding of µm-diameter aluminum wires for the Electric Solar Wind Sail
TL;DR: In this paper, an ultrasonic wire-to-wire bonding method for bonding two micrometer-thick metal wires together was proposed, where a special jig and an industrial wire bonder performed the bonding.
Journal ArticleDOI
One kilometer (1 km) electric solar wind sail tether produced automatically.
Henri Seppänen,Timo Rauhala,S.K. Kiprich,Jukka Ukkonen,Martin Simonsson,Risto Kurppa,Pekka Janhunen,Edward Hæggström,Edward Hæggström +8 more
TL;DR: A 1 km continuous piece of multifilament electric solar wind sail tether of μm-diameter aluminum wires using a custom made automatic tether factory is produced, demonstrating that production of long electric solarWind sail tethers is possible and practical.
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Real time contact resistance measurement to determine when microwelds start to form during ultrasonic wire bonding
TL;DR: In this article, contact resistance was used as a tool to determine the instant when microwelds start to form during ultrasonic bonding, which can reduce the uncertainty in the estimated bonded area by 5-18%.
Proceedings ArticleDOI
Real-time nondestructive contact resistance method to estimate wire bond pull force
TL;DR: In this paper, the authors estimate microelectronic wire bond quality by measuring the contact resistance (CR) of the bond in situ during the bonding process using a Kelvin cross setup contacting the wedge, 25 um Al wire and an Au substrate.