Three parallel algorithms for classical molecular dynamics are presented. The first assigns each processor a fixed subset of atoms; the second assigns each a fixed subset of inter-atomic forces to compute; the third assigns each a fixed spatial region. The algorithms are suitable for molecular dynamics models which can be difficult to parallelize efficiently—those with short-range forces where the neighbors of each atom change rapidly. They can be implemented on any distributed-memory parallel machine which allows for message-passing of data between independently executing processors. The algorithms are tested on a standard Lennard-Jones benchmark problem for system sizes ranging from 500 to 100,000,000 atoms on several parallel supercomputers--the nCUBE 2, Intel iPSC/860 and Paragon, and Cray T3D. Comparing the results to the fastest reported vectorized Cray Y-MP and C90 algorithm shows that the current generation of parallel machines is competitive with conventional vector supercomputers even for small problems. For large problems, the spatial algorithm achieves parallel efficiencies of 90% and a 1840-node Intel Paragon performs up to 165 faster than a single Cray C9O processor. Trade-offs between the three algorithms and guidelines for adapting them to more complex molecular dynamics simulations are also discussed.

Fast parallel algorithms for short-range molecular dynamics

Single-layer metal dichalcogenides are two-dimensional semiconductors that present strong potential for electronic and sensing applications complementary to that of graphene.

/pdf/electronics-and-optoelectronics-of-two-dimensional-2jbqr1unvw.pdf

Electronics and optoelectronics of two-dimensional transition metal dichalcogenides.

Atom transfer radical polymerization.

Research in the use of organic polymers as the active semiconductors in light-emitting diodes has advanced rapidly, and prototype devices now meet realistic specifications for applications. These achievements have provided insight into many aspects of the background science, from design and synthesis of materials, through materials fabrication issues, to the semiconductor physics of these polymers.

Electroluminescence in conjugated polymers

"Space—the final frontier." This preamble to a well-known television series captures the challenge encountered not only in space travel adventures, but also in the field of porous materials, which aims to control the size, shape and uniformity of the porous space and the atoms and molecules that define it. The past decade has seen significant advances in the ability to fabricate new porous solids with ordered structures from a wide range of different materials. This has resulted in materials with unusual properties and broadened their application range beyond the traditional use as catalysts and adsorbents. In fact, porous materials now seem set to contribute to developments in areas ranging from microelectronics to medical diagnosis.

Ordered porous materials for emerging applications

Polysilane high polymers

Second-order nonlinearity in poled-polymer systems

As technology continues towards smaller, thinner and lighter devices, more stringent demands are placed on thin polymer films as diffusion barriers, dielectric coatings, electronic packaging and so on. Therefore, there is a growing need for testing platforms to rapidly determine the mechanical properties of thin polymer films and coatings. We introduce here an elegant, efficient measurement method that yields the elastic moduli of nanoscale polymer films in a rapid and quantitative manner without the need for expensive equipment or material-specific modelling. The technique exploits a buckling instability that occurs in bilayers consisting of a stiff, thin film coated onto a relatively soft, thick substrate. Using the spacing of these highly periodic wrinkles, we calculate the film's elastic modulus by applying well-established buckling mechanics. We successfully apply this new measurement platform to several systems displaying a wide range of thicknessess (nanometre to micrometre) and moduli (MPa to GPa).

/pdf/a-buckling-based-metrology-for-measuring-the-elastic-moduli-20ezyxntpm.pdf

A buckling-based metrology for measuring the elastic moduli of polymeric thin films

Modern computer microprocessor chips are marvels of engineering complexity. For the current 45 nm technology node, there may be nearly a billion transistors on a chip barely 1 cm2 and more than 10 000 m of wiring connecting and powering these devices distributed over 9-10 wiring levels. This represents quite an advance from the first INTEL 4004B microprocessor chip introduced in 1971 with 10 μm minimum dimensions and 2 300 transistors on the chip! It has been disclosed that advanced microprocessor chips at the 32 nm node will have more than 2 billion transistors.1 For instance, Figure 1 shows a sectional 3D image of a 90 nm IBM microprocessor, containing several hundred million integrated devices and 10 levels of interconnect wiring, designated as the back-end-of-the-line (BEOL). Since the invention of microprocessors, the number of active devices on a chip has been exponentially increasing, approximately doubling every two years. This trend was first described in 1965 by Gordon Moore,2 although the original discussion suggested doubling the number of devices every year, and the phenomenon became popularly known as Moore’s Law. This progress has proven remarkably resilient and has persisted for more than 50 years. The enabler that has permitted these advances is known as scaling, that is, the reduction of minimum device dimensions by lithographic advances (photoresists, tooling, and process integration optimization) by ∼30% for each device generation.3 It allowed more active devices to be incorporated in a given area and improved the operating characteristics of the individual transistors. It should be emphasized that the earlier improvements in chip performance were achieved with very few changes in the materials used in the construction of the chips themselves. The increase of performance with scaling * Corresponding author. E-mail: gdubois@us.ibm.com. † IBM Almaden Research Center. ‡ Stanford University. Willi Volksen received his B.S. in Chemistry (magna cum laude) from New Mexico Institute of Mining and Technology in 1972 and his Ph.D. in Chemistry/Polymer Science from the University of Massachusetts, Lowell, in 1975. He then joined the research group of Prof. Harry Gray/Dr. Alan Rembaum at the California Institute of Technology as a postdoctoral fellow and upon completion of the one-year appointment joined Dr. Rembaum at the Jet Propulsion Laboratory as a Senior Chemist in 1976. In 1977 Dr. Volksen joined the IBM Research Division at the IBM Almaden Research Center in San Jose, CA, where he is an active research staff member in the Advanced Materials Group of the Science and Technology function.

Low dielectric constant materials.

The molecular organization in ultrathin polymer films (thicknesses less than 1000 angstroms) and thin polymer films (thicknesses between 1000 and 10,000 angstroms) may differ substantially from that of bulk polymers, which can lead to important differences in resulting thermophysical properties. Such constrained geometry films have been fabricated from amorphous poly(3-methyl-4-hydroxy styrene) (PMHS) and semicrystalline poly(di-n-hexyl silane) (PD6S) by means of spin-casting. The residual solvent content is substantially greater in ultrathin PMHS films, which suggests a higher glass transition temperature that results from a stronger hydrogen-bonded network as compared with that in thicker films. Crystallization of PD6S is substantially hindered in ultrathin films, in which a critical thickness of 150 angstroms is needed for crystalline morphology to exist and in which the rate of crystallization is initially slow but increases rapidly as the film approaches 500 angstroms in thickness.

https://science.sciencemag.org/content/sci/273/5277/912.full.pdf

Robert D. Miller

Papers

Polysilane high polymers

Second-order nonlinearity in poled-polymer systems

A buckling-based metrology for measuring the elastic moduli of polymeric thin films

Low dielectric constant materials.

Structure in Thin and Ultrathin Spin-Cast Polymer Films