R
Ryan C. Hayward
Researcher at University of Massachusetts Amherst
Publications - 172
Citations - 12665
Ryan C. Hayward is an academic researcher from University of Massachusetts Amherst. The author has contributed to research in topics: Polymer & Copolymer. The author has an hindex of 56, co-authored 157 publications receiving 10700 citations. Previous affiliations of Ryan C. Hayward include University of Colorado Boulder & University of California, Santa Barbara.
Papers
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Designing responsive buckled surfaces by halftone gel lithography.
TL;DR: A method of photopatterning polymer films that yields temperature-responsive gel sheets that can transform between a flat state and a prescribed three-dimensional shape is introduced, based on poly(N-isopropylacrylamide) copolymers containing pendent benzophenone units that allow cross-linking to be tuned by irradiation dose.
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Using origami design principles to fold reprogrammable mechanical metamaterials
Jesse L. Silverberg,Arthur A. Evans,Lauren McLeod,Ryan C. Hayward,Thomas C. Hull,Christian D. Santangelo,Itai Cohen +6 more
TL;DR: Working with the Miura-ori tessellation, it is found that each unit cell of this crease pattern is mechanically bistable, and by switching between states, the compressive modulus of the overall structure can be rationally and reversibly tuned.
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General Predictive Syntheses of Cubic, Hexagonal, and Lamellar Silica and Titania Mesostructured Thin Films§
Peter C.A. Alberius,Karen L. Frindell,Ryan C. Hayward,Edward J. Kramer,Galen D. Stucky,Bradley F. Chmelka +5 more
TL;DR: In this paper, a cubic mesostructure with crystalline TiO2 (anatase) in the walls, stable to 400 °C, was synthesized by varying the volume ratio between the copolymer and inorganic components of the precursor solution.
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Electrophoretic assembly of colloidal crystals with optically tunable micropatterns
TL;DR: It is shown that light affects the assembly processes, and how to produce patterns using electrophoretic deposition in the presence of an ultraviolet (UV) illumination motif is demonstrated.
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Surface wrinkles for smart adhesion
TL;DR: In this article, the authors proposed a method to develop synthetic analogs as smart adhesives, that is, where the geometry of the pattern can tailor the adhesion of the material.