There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality.

Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

I and i

An introduction to heat transfer

Gallium oxide (Ga2O3) is emerging as a viable candidate for certain classes of power electronics, solar blind UV photodetectors, solar cells, and sensors with capabilities beyond existing technologies due to its large bandgap. It is usually reported that there are five different polymorphs of Ga2O3, namely, the monoclinic (β-Ga2O3), rhombohedral (α), defective spinel (γ), cubic (δ), or orthorhombic (e) structures. Of these, the β-polymorph is the stable form under normal conditions and has been the most widely studied and utilized. Since melt growth techniques can be used to grow bulk crystals of β-GaO3, the cost of producing larger area, uniform substrates is potentially lower compared to the vapor growth techniques used to manufacture bulk crystals of GaN and SiC. The performance of technologically important high voltage rectifiers and enhancement-mode Metal-Oxide Field Effect Transistors benefit from the larger critical electric field of β-Ga2O3 relative to either SiC or GaN. However, the absence of clear demonstrations of p-type doping in Ga2O3, which may be a fundamental issue resulting from the band structure, makes it very difficult to simultaneously achieve low turn-on voltages and ultra-high breakdown. The purpose of this review is to summarize recent advances in the growth, processing, and device performance of the most widely studied polymorph, β-Ga2O3. The role of defects and impurities on the transport and optical properties of bulk, epitaxial, and nanostructures material, the difficulty in p-type doping, and the development of processing techniques like etching, contact formation, dielectrics for gate formation, and passivation are discussed. Areas where continued development is needed to fully exploit the properties of Ga2O3 are identified.

A review of Ga2O3 materials, processing, and devices

Manufacturing-oriented topology optimization has been extensively studied the past two decades, in particular for the conventional manufacturing methods, for example, machining and injection molding or casting. Both design and manufacturing engineers have benefited from these efforts because of the close-to-optimal and friendly-to-manufacture design solutions. Recently, additive manufacturing (AM) has received significant attention from both academia and industry. AM is characterized by producing geometrically complex components layer-by-layer, and greatly reduces the geometric complexity restrictions imposed on topology optimization by conventional manufacturing. In other words, AM can make near-full use of the freeform structural evolution of topology optimization. Even so, new rules and restrictions emerge due to the diverse and intricate AM processes, which should be carefully addressed when developing the AM-specific topology optimization algorithms. Therefore, the motivation of this perspective paper is to summarize the state-of-art topology optimization methods for a variety of AM topics. At the same time, this paper also expresses the authors' perspectives on the challenges and opportunities in these topics. The hope is to inspire both researchers and engineers to meet these challenges with innovative solutions.

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Current and future trends in topology optimization for additive manufacturing

BACKGROUNDMetallic components are the cornerstone of modern industries such as aviation, aerospace, automobile manufacturing, and energy production. The stringent requirements for high-performance metallic components impede the optimization of materials selection and manufacturing. Laser-based additive manufacturing (AM) is a key strategic technology for technological innovation and industrial sustainability. As the number of applications increases, so do the scientific and technological challenges. Because laser AM has domain-by-domain (e.g., point-by-point, line-by-line, and layer-by-layer) localized forming characteristics, the requisite for printing process and performance control encompasses more than six orders of magnitude, from the microstructure (nanometer- to micrometer-scale) to macroscale structure and performance of components (millimeter- to meter-scale). The traditional route of laser-metal AM follows a typical “series mode” from design to build, resulting in a cumbersome trial-and-error methodology that creates challenges for obtaining high-performance goals.ADVANCESWe propose a holistic concept of material-structure-performance integrated additive manufacturing (MSPI-AM) to cope with the extensive challenges of AM. We define MSPI-AM as a one-step AM production of an integral metallic component by integrating multimaterial layout and innovative structures, with an aim to proactively achieve the designed high performance and multifunctionality. Driven by the performance or function to be realized, the MSPI-AM methodology enables the design of multiple materials, new structures, and corresponding printing processes in parallel and emphasizes their mutual compatibility, providing a systematic solution to the existing challenges for laser-metal AM. MSPI-AM is defined by two methodological ideas: “the right materials printed in the right positions” and “unique structures printed for unique functions.” The increasingly creative methods for engineering both micro- and macrostructures within single printed components have led to the use of AM to produce more complicated structures with multimaterials. It is now feasible to design and print multimaterial components with spatially varying microstructures and properties (e.g., nanocomposites, in situ composites, and gradient materials), further enabling the integration of functional structures with electronics within the volume of a laser-printed monolithic part. These complicated structures (e.g., integral topology optimization structures, biomimetic structures learned from nature, and multiscale hierarchical lattice or cellular structures) have led to breakthroughs in both mechanical performance and physical/chemical functionality. Proactive realization of high performance and multifunctionality requires cross-scale coordination mechanisms (i.e., from the nano/microscale to the macroscale).OUTLOOKOur MSPI-AM continues to develop into a practical methodology that contributes to the high performance and multifunctionality goals of AM. Many opportunities exist to enhance MSPI-AM. MSPI-AM relies on a more digitized material and structure development and printing, which could be accomplished by considering different paradigms for AM materials discovery with the Materials Genome Initiative, standardization of formats for digitizing materials and structures to accelerate data aggregation, and a systematic printability database to enhance autonomous decision-making of printers. MSPI-oriented AM becomes more intelligent in processes and production, with the integration of intelligent detection, sensing and monitoring, big-data statistics and analytics, machine learning, and digital twins. MSPI-AM further calls for more hybrid approaches to yield the final high-performance/multifunctional achievements, with more versatile materials selection and more comprehensive integration of virtual manufacturing and real production to navigate more complex printing. We hope that MSPI-AM can become a key strategy for the sustainable development of AM technologies. Download high-res image Open in new tab Download PowerpointMaterial-structure-performance integrated additive manufacturing (MSPI-AM).Versatile designed materials and innovative structures are simultaneously printed within an integral metallic component to yield high performance and multifunctionality, integrating in parallel the core elements of material, structure, process, and performance and a large number of related coupling elements and future potential elements to enhance the multifunctionality of printed components and the maturity and sustainability of laser AM technologies.

Material-structure-performance integrated laser-metal additive manufacturing.

Topology optimization of an air-cooled heat sink considering heat conduction plus side-surface convection is presented. The optimization formulation is explained along with multiple design examples. A postprocessing procedure is described to synthesize manifold or “water-tight” solid model computer-aided design (CAD) geometry from three-dimensional (3D) point-cloud data extracted from the optimization result. Using this process, a heat sink is optimized for confined jet impingement air cooling. A prototype structure is fabricated out of AlSi12 using additive layer manufacturing (ALM). The heat transfer and fluid flow performance of the optimized heat sink are experimentally evaluated, and the results are compared with benchmark plate and pin-fin heat sink geometries that are conventionally machined out of aluminum and copper. In two separate test cases, the experimental results indicate that the optimized ALM heat sink design has a higher coefficient of performance (COP) relative to the benchmark heat sink designs.

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Rankine Cycle (RC) is a thermodynamic cycle that converts thermal energy into mechanical work, which is commonly found in thermal power generation plants. Recently, there have been many studies focusing on applying Rankine Cycle to recover low-grade waste heat. On-road vehicles, which convert around one third of the fuel energy into useful mechanical energy for propulsion, are moving energy conversion systems that generate considerable waste heat. It is found from prior research that the Rankine Cycle has great potential in automobile waste heat harvesting applications. However, in contrast with other low-grade waste heat applications, vehicles have limited space for the RC system integration, and the waste heat is relatively unsteady. In this work, the efforts in the past few decades to apply RC to on-road vehicles, specifically passenger cars, are reviewed. Characteristics of the waste heat sources found in vehicles and the constraints put on the automotive RC application are identified. Rankine Cycle architectures, system components, and working fluids suitable to different applications are summarized, which provides a guideline for future RC system design in automobiles. Lastly, a new concept and case study into the future application of Rankine Cycle to vehicle waste heat recovery (WHR) is provided.

A review and future application of Rankine Cycle to passenger vehicles for waste heat recovery

Two-phase jet impingement cooling for high heat flux wide band-gap devices using multi-scale porous surfaces.

Effect of sub-cooling on performance of a multi-jet two phase cooler with multi-scale porous surfaces

This article proposes an unsupervised learning approach for fault prognosis of silicon carbide (SiC) mosfet s. The proposed approach utilizes the changing trend of a device's voltage, current, temperature, and other device characteristics with its degradation. The failure modes of semiconductors are reviewed along with existing methods for fault prognosis. The proposed approach is the first to address prognostics of SiC devices, and it can avoid the effects from system noise and data errors. It is not limited to offline analysis and is targeted at online implementation. It is easy to implement on standard digital platforms, and has fast computational speed. Offline data analysis is performed to verify the effectiveness of the proposed method, and a processor-in-the-loop system is used to verify its ability to perform online fault prognosis.

Shailesh N. Joshi

Papers

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

A review and future application of Rankine Cycle to passenger vehicles for waste heat recovery

Two-phase jet impingement cooling for high heat flux wide band-gap devices using multi-scale porous surfaces.

Effect of sub-cooling on performance of a multi-jet two phase cooler with multi-scale porous surfaces

Data-Driven Approach for Fault Prognosis of SiC MOSFETs