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Shutao Wen

Researcher at Dalian University of Technology

Publications -  26
Citations -  229

Shutao Wen is an academic researcher from Dalian University of Technology. The author has contributed to research in topics: Silicon & Directional solidification. The author has an hindex of 8, co-authored 26 publications receiving 189 citations. Previous affiliations of Shutao Wen include University of Padua.

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Removal of aluminum and calcium in multicrystalline silicon by vacuum induction melting and directional solidification

TL;DR: Based on the concentration distributions of aluminum and calcium along the growth direction, the removal mechanism of such impurities with both high saturated vapor pressures and low segregation coefficients is investigated in this paper, where the results show that the removal of this type of impurities only depends on evaporation during vacuum induction melting process, thus their contents decrease significantly due to the strongly eva-oration under the high temperature and high vacuum conditions.
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Removal of Cu, Mn and Na in multicrystalline silicon by directional solidification under low vacuum condition

TL;DR: A multicrystalline silicon ingot was obtained from metallurgical-grade silicon after directional solidification under low vacuum condition, and the concentration distributions of metal impurities such as copper (Cu), manganese (Mn), and sodium (Na) along the growth direction of the ingot were investigated.
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Electromagnetic separation of silicon carbide inclusions with aluminum penetration in silicon by imposition of supersonic frequency magnetic field

TL;DR: In this paper, the electromagnetic separation of silicon carbide inclusions in multicrystalline silicon by imposition of supersonic-frequency magnetic field was investigated, and the separation efficiency reached up to 89.3% at a holding time of 45 min.
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Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam melting

TL;DR: In this article, a theoretical model was proposed to determine the thermal contact resistance (TCR) on the surfaces of silicon and copper during electron beam melting, and the effect of temperature and pressure on TCR based on specific melting process conditions was discussed.
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Numerical simulation for parameter optimization of silicon purification by electron beam melting

TL;DR: In this paper, a mathematical model is developed to investigate the removal of volatile impurities in molten silicon by electron beam melting (EBM) with a high efficiency and low energy consumption.