scispace - formally typeset
S

Simona Lorenti

Researcher at STMicroelectronics

Publications -  47
Citations -  522

Simona Lorenti is an academic researcher from STMicroelectronics. The author has contributed to research in topics: Silicon & Annealing (metallurgy). The author has an hindex of 13, co-authored 47 publications receiving 489 citations.

Papers
More filters
Journal ArticleDOI

High efficiency light emitting devices in silicon

TL;DR: In this article, a Si-based resonant cavity light emitting diode (RCLED) was constructed using chemical vapour deposition on a silicon substrate, where the Si/SiO 2 Fabry-Perot microcavities were fabricated to enhance the external quantum emission along the cavity axis and the spectral purity of emission from the films that were used as active media to fabricate a Sibased cavity light-emitting diode.
Journal ArticleDOI

Fabrication of miniaturised Si-based electrocatalytic membranes

TL;DR: In this article, preliminary results concerning the micromachining procedure for fabricating a Si-based electrocatalytic membrane for miniaturised Si based proton exchange membrane fuel cells (PEMFC) are presented.
Journal ArticleDOI

The early oxynitridation stages of hydrogen-terminated (100) silicon after exposure to N2:N2O. III. Initial conditions

TL;DR: The structure and thermal stability in N2 of hydrogen-terminated (100) silicon has been studied by X-ray photoemission spectroscopy, transmission electron microscopy, atomic force microscopy and thermal programmed desorption, and reflection high energy electron diffraction as discussed by the authors.
Journal ArticleDOI

Temperature-dependent Fowler-Nordheim electron barrier height in SiO2/4H-SiC MOS capacitors

TL;DR: In this article, the physical and temperature-dependent electrical characterizations of the oxide/semiconductor interface in MOS capacitors with a SiO 2 layer deposited on 4H-SiC using dichlorosilane and nitrogen-based vapor precursors were reported.
Patent

Manufacturing method for a semiconductor substrate comprising at least a buried cavity and devices formed with this method

TL;DR: In this article, a method for manufacturing a semiconductor substrate of a first concentration type, which comprises at least a buried insulating cavity, is described, comprising the following steps: forming a plurality of trenches, forming a surface layer on the substrate in order to close superficially the plurality, forming in the meantime a buried cavity in correspondence with the surface-distal end of the trenches.