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Toshihiko Kosugi

Researcher at Nippon Telegraph and Telephone

Publications -  95
Citations -  1747

Toshihiko Kosugi is an academic researcher from Nippon Telegraph and Telephone. The author has contributed to research in topics: Amplifier & Monolithic microwave integrated circuit. The author has an hindex of 20, co-authored 95 publications receiving 1632 citations.

Papers
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Proceedings ArticleDOI

Rain attenuation statistics for a 120-GHz-band wireless link

TL;DR: In this paper, a propagation study focused on rain attenuation on 120 GHz band wireless link with V polarization was conducted in Atsugi, Japan from December 2007 to September 2008.
Proceedings ArticleDOI

Tunable coplanar filter for F-band wireless receivers

TL;DR: In this article, a tunable-filter for a 120 GHz-band receiver MMIC, which is used for a 10Gbit/s wireless link, was designed and fabricated, and the filter can change both the center frequency and bandwidth simultaneously.
Proceedings ArticleDOI

20-Gbit/s ASK wireless system in 300-GHz-band and front-ends with InP MMICs

TL;DR: In this paper, a 20Gbit/s ASK wireless system in the 300 GHz band for kiosk data downloading is presented, where the front-ends (transmitter and receiver) are manufactured by using InP-based monolithic microwave integrated circuits with high electron mobility transistors.
Proceedings ArticleDOI

10-Gbit/s wireless link systems using the 120-GHz band

TL;DR: Using two types of 10-Gbit/s wireless link systems using the 120-GHz band, one employs photonic technologies for the generation, modulation, and amplification of 125-GHz signals and the other is an all-electronic system that has advantages of compactness and low cost.
Journal ArticleDOI

An x‐ray photoelectron spectroscopy study on ion beam induced deposition of tungsten using WF6

TL;DR: In this article, the deposition process of tungsten from WF6 during ion beam bombardment has been studied using in situ XPS measurements, and the deposition was done using low energy beam of Ar+ and H+2, which was important to reduce damage in the substrate.