Trevor D. Howes

TL;DR: In this paper, material pulverization was discovered on the surface layer of ground ceramics, which was the dominant material-removal mechanism as long as depth of cut was smaller than a critical value.

TL;DR: In this article, the most recent developments in abrasive machining are reviewed pointing out problems to be solved for their practical applications in the near future, and they concluded that promising abrasive technologies of the future should include: grinding wheels with ultrafine grits, molecular dynamics surface integrity assessment techniques, high-speed abrasives machining with CBN, autonomous machining system implementing intelligent control and advanced monitoring systems, and coolant-free grinding.

TL;DR: In the case of grinding fluids, these trends have resulted in an emphasis on fluid maintenance in order to minimize the amount of waste generated, to extend the life of the fluid, and to mitigate negative effects on worker health as discussed by the authors.

TL;DR: In this paper, a combination of scanning electron microscopy and damage inspection techniques on silicon nitride, alumina, and silicon carbide ground by diamond wheels with various grit sizes was used to evaluate the penetration depth of subsurface damage.