Power dissipation and thermal issues are increasingly significant in modern processors. As a result, it is crucial that power/performance tradeoffs be made more visible to chip architects and even compiler writers, in addition to circuit designers. Most existing power analysis tools achieve high accuracy by calculating power estimates for designs only after layout or floorplanning are complete. In addition to being available only late in the design process, such tools are often quite slow, which compounds the difficulty of running them for a large space of design possibilities.This paper presents Wattch, a framework for analyzing and optimizing microprocessor power dissipation at the architecture-level. Wattch is 1000X or more faster than existing layout-level power tools, and yet maintains accuracy within 10% of their estimates as verified using industry tools on leading-edge designs. This paper presents several validations of Wattch's accuracy. In addition, we present three examples that demonstrate how architects or compiler writers might use Wattch to evaluate power consumption in their design process.We see Wattch as a complement to existing lower-level tools; it allows architects to explore and cull the design space early on, using faster, higher-level tools. It also opens up the field of power-efficient computing to a wider range of researchers by providing a power evaluation methodology within the portable and familiar SimpleScalar framework.

Wattch: a framework for architectural-level power analysis and optimizations

This paper introduces McPAT, an integrated power, area, and timing modeling framework that supports comprehensive design space exploration for multicore and manycore processor configurations ranging from 90nm to 22nm and beyond. At the microarchitectural level, McPAT includes models for the fundamental components of a chip multiprocessor, including in-order and out-of-order processor cores, networks-on-chip, shared caches, integrated memory controllers, and multiple-domain clocking. At the circuit and technology levels, McPAT supports critical-path timing modeling, area modeling, and dynamic, short-circuit, and leakage power modeling for each of the device types forecast in the ITRS roadmap including bulk CMOS, SOI, and double-gate transistors. McPAT has a flexible XML interface to facilitate its use with many performance simulators. Combined with a performance simulator, McPAT enables architects to consistently quantify the cost of new ideas and assess tradeoffs of different architectures using new metrics like energy-delay-area2 product (EDA2P) and energy-delay-area product (EDAP). This paper explores the interconnect options of future manycore processors by varying the degree of clustering over generations of process technologies. Clustering will bring interesting tradeoffs between area and performance because the interconnects needed to group cores into clusters incur area overhead, but many applications can make good use of them due to synergies of cache sharing. Combining power, area, and timing results of McPAT with performance simulation of PARSEC benchmarks at the 22nm technology node for both common in-order and out-of-order manycore designs shows that when die cost is not taken into account clustering 8 cores together gives the best energy-delay product, whereas when cost is taken into account configuring clusters with 4 cores gives the best EDA2P and EDAP.

/pdf/mcpat-an-integrated-power-area-and-timing-modeling-framework-38b785sayc.pdf

McPAT: an integrated power, area, and timing modeling framework for multicore and manycore architectures

This article describes architectural and algorithmic approaches that designers can use to enhance the energy awareness of wireless sensor networks. The article starts off with an analysis of the power consumption characteristics of typical sensor node architectures and identifies the various factors that affect system lifetime. We then present a suite of techniques that perform aggressive energy optimization while targeting all stages of sensor network design, from individual nodes to the entire network. Maximizing network lifetime requires the use of a well-structured design methodology, which enables energy-aware design and operation of all aspects of the sensor network, from the underlying hardware platform to the application software and network protocols. Adopting such a holistic approach ensures that energy awareness is incorporated not only into individual sensor nodes but also into groups of communicating nodes and the entire sensor network. By following an energy-aware design methodology based on techniques such as in this article, designers can enhance network lifetime by orders of magnitude.

/pdf/energy-aware-wireless-microsensor-networks-34nqlav6jf.pdf

Energy-aware wireless microsensor networks

Designers can execute programs on software models to validate a proposed hardware design's performance and correctness, while programmers can use these models to develop and test software before the real hardware becomes available. Three critical requirements drive the implementation of a software model: performance, flexibility, and detail. Performance determines the amount of workload the model can exercise given the machine resources available for simulation. Flexibility indicates how well the model is structured to simplify modification, permitting design variants or even completely different designs to be modeled with ease. Detail defines the level of abstraction used to implement the model's components. The SimpleScalar tool set provides an infrastructure for simulation and architectural modeling. It can model a variety of platforms ranging from simple unpipelined processors to detailed dynamically scheduled microarchitectures with multiple-level memory hierarchies. SimpleScalar simulators reproduce computing device operations by executing all program instructions using an interpreter. The tool set's instruction interpreters also support several popular instruction sets, including Alpha, PPC, x86, and ARM.

SimpleScalar: an infrastructure for computer system modeling

With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processor-level techniques that can regulate operating temperature when the package's capacity is exceeded. Evaluating such techniques, however, requires a thermal model that is practical for architectural studies.This paper describes HotSpot, an accurate yet fast model based on an equivalent circuit of thermal resistances and capacitances that correspond to microarchitecture blocks and essential aspects of the thermal package. Validation was performed using finite-element simulation. The paper also introduces several effective methods for dynamic thermal management (DTM): "temperature-tracking" frequency scaling, localized toggling, and migrating computation to spare hardware units. Modeling temperature at the microarchitecture level also shows that power metrics are poor predictors of temperature, and that sensor imprecision has a substantial impact on the performance of DTM.

Temperature-aware microarchitecture

Embedded computer systems are characterized by the presence of a dedicated processor and the software that runs on it Power constraints are increasingly becoming the critical component of the design specification of these systems At present, however, power analysis tools can only be applied at the lower levels of the design-the circuit or gate level It is either impractical or impossible to use the lower level tools to estimate the power cost of the software component of the system This paper describes the first systematic attempt to model this power cost A power analysis technique is developed that has been applied to two commercial microprocessors-Intel 486DX2 and Fujitsu SPARClite 934 This technique can be employed to evaluate the power cost of embedded software This can help in verifying if a design meets its specified power constraints Further, it can also be used to search the design space in software power optimization Examples with power reduction of up to 40%, obtained by rewriting code using the information provided by the instruction level power model, illustrate the potential of this idea >

Power analysis of embedded software: a first step towards software power minimization

The increasing popularity of power constrained mobile computers and embedded computing applications drives the need for analyzing and optimizing power in all the components of a system. Software constitutes a major component of today's systems, and its role is projected to grow even further. Thus, an ever increasing portion of the functionality of today's systems is in the form of instructions, as opposed to gates. This motivates the need for analyzing power consumption from the point of view of instructions--something that traditional circuit and gate level power analysis tools are inadequate for. This paper describes an alternative, measurement based instruction level power analysis approach that provides an accurate and practical way of quantifying the power cost of soft-ware. This technique has been applied to three commercial, architecturally different processors. The salient results of these analyses are summarized. Instruction level analysis of a processor helps in the development of models for power consumption of software executing on that processor. The power models for the subject processors are described and interesting observations resulting from the comparison of these models are highlighted. The ability to evaluate software in terms of power consumption makes it feasible to seach fow low power implementations of given programs. In addition, it can guide the development of general tools and techniques for low power software. Several ideas in this regard as motivated by the power analysis of the subject processors are also described.

Instruction level power analysis and optimization of software

Power consumption has become one of the biggest challenges in high-performance microprocessor design. The rapid increase in the complexity and speed of each new CPU generation is outstripping the benefits of voltage reduction and feature size scaling. Designers are thus continuously challenged to come up with innovative ways to reduce power, while trying to meet all the other constraints imposed on the design. This paper presents an overview of the issues related to power consumption in the context of Intel CPUs. The main trends that are driving the increased focus on design for low power are described. System and benchmarking issues, and sources of power consumption in a high-performance CPU are briefly described. Techniques that have been tried on real designs in the past are described. The role of CAD tools and their limitations in this domain will also be discussed. In addition, areas that need increased research focus in the future are also pointed out.

/pdf/reducing-power-in-high-performance-microprocessors-58l3hdx0ud.pdf

Reducing power in high-performance microprocessors

Power is becoming a critical constraint for designing embedded applications. Current power analysis techniques based on circuit-level or architectural-level simulation are either impractical or inaccurate to estimate the power cost for a given piece of application software. In this paper, an instruction-level power analysis model is developed for an embedded digital signal processor (DSP) based on physical current measurements. Significant points of difference have been observed between the software power model for this custom DSP processor and the power models that have been developed earlier for some general purpose commercial microprocessors. In particular, the effect of circuit state on the power cost of an instruction stream is more marked in the case of this DSP processor. In addition, the processor has special architectural features that allow dual memory accesses and packing of instructions into pairs. The energy reduction possible through the use of these features is studied. The on-chip Booth multiplier on the processor is a major source of energy consumption for DSP programs. A microarchitectural power model for the multiplier is developed and analyzed for further power minimization. In order to exploit all of the above effects, a scheduling technique based on the new instruction-level power model is proposed. Several example programs are provided to illustrate the effectiveness of this approach. Energy reductions varying from 26% to 73% have been observed. These energy savings are real and have been verified through physical measurement. It should be noted that the energy reduction essentially comes for free. It is obtained through software modification, and thus, entails no hardware overhead. In addition, there is no loss of performance since the running times of the modified programs either improve or remain unchanged.

Vivek Tiwari

Papers

Wattch: a framework for architectural-level power analysis and optimizations

Power analysis of embedded software: a first step towards software power minimization

Instruction level power analysis and optimization of software

Reducing power in high-performance microprocessors

Power analysis and minimization techniques for embedded DSP software