Walter Dauksher

TL;DR: In this article, the lead-free solder joint reliability of several printed circuit board mounted high-density packages, when subjected to temperature cycling was investigated by finite element modelling, and the packages were a 256pin plastic ball grid array (PBGA), a 388pin PBGA, and a 1657pin ceramic column grid array.

TL;DR: In this article, the reliability and the confidence levels for comparing the quality (mean life) of lead-free solder joints of high-density packages are determined, and a data acquisition system, the relevant failure criterion, and the data extraction method are presented and examined.

TL;DR: In this paper, failure analysis of high-density packages such as the plastic ball grid array and the ceramic column grid array soldered on SnCu hot-air solder levelling electroless nickel-immersion gold or NiAu, and organic solderability preservative Entek printed circuit boards is presented.

TL;DR: In this paper, the 2-parameter Weibull distribution is used for modeling the thermal-fatigue life of lead-free solder joints. But, the authors only used the 3-parameters of the distribution and did not consider the 4th dimension.

TL;DR: The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high-density packages using lead-free solder as discussed by the authors, and the design, material, and assembly process aspects of the project were addressed in this paper.