Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging

Review of pool boiling enhancement by surface modification

Thermal management is one of the main challenges for the future of electronics1–5. With the ever-increasing rate of data generation and communication, as well as the constant push to reduce the size and costs of industrial converter systems, the power density of electronics has risen6. Consequently, cooling, with its enormous energy and water consumption, has an increasingly large environmental impact7,8, and new technologies are needed to extract the heat in a more sustainable way—that is, requiring less water and energy9. Embedding liquid cooling directly inside the chip is a promising approach for more efficient thermal management5,10,11. However, even in state-of-the-art approaches, the electronics and cooling are treated separately, leaving the full energy-saving potential of embedded cooling untapped. Here we show that by co-designing microfluidics and electronics within the same semiconductor substrate we can produce a monolithically integrated manifold microchannel cooling structure with efficiency beyond what is currently available. Our results show that heat fluxes exceeding 1.7 kilowatts per square centimetre can be extracted using only 0.57 watts per square centimetre of pumping power. We observed an unprecedented coefficient of performance (exceeding 10,000) for single-phase water-cooling of heat fluxes exceeding 1 kilowatt per square centimetre, corresponding to a 50-fold increase compared to straight microchannels, as well as a very high average Nusselt number of 16. The proposed cooling technology should enable further miniaturization of electronics, potentially extending Moore’s law and greatly reducing the energy consumption in cooling of electronics. Furthermore, by removing the need for large external heat sinks, this approach should enable the realization of very compact power converters integrated on a single chip. Cooling efficiency is greatly increased by directly embedding liquid cooling into electronic chips, using microfluidics-based heat sinks that are designed in conjunction with the electronics within the same semiconductor substrate.

/pdf/co-designing-electronics-with-microfluidics-for-more-5aa1udo1ts.pdf

Co-designing electronics with microfluidics for more sustainable cooling.

Previous intracytoplasmic sperm injection (ICSI) studies have indicated significant variation in ICSI success rates among different species. In mouse ICSI, the zona pellucida (ZP) undergoes a "hardening" process at fertilization in order to prevent subsequent sperm from penetrating. There have been few studies investigating changes in the mechanical properties of mouse ZP post fertilization. To characterize mouse ZP mechanical properties and quantitate the mechanical property differences of the ZP before and after fertilization, a microelectromechanical systems-based multiaxis cellular force sensor has been developed. A microrobotic cell manipulation system employing the multiaxis cellular force sensor is used to conduct mouse ZP force sensing, establishing a quantitative relationship between applied forces and biomembrane structural deformations on both mouse oocytes and embryos. An analytical biomembrane elastic model is constructed to describe biomembrane mechanical properties. The characterized elastic modulus of embryos is 2.3 times that of oocytes, and the measured forces for puncturing embryo ZP are 1.7 times those for oocyte ZP. The technique and model presented in this paper can be applied to investigations into the mechanical properties of other biomembranes, such as the plasma membrane of oocytes or other cell types.

/pdf/mechanical-property-characterization-of-mouse-zona-pellucida-3p2t7avpxx.pdf

Mechanical property characterization of mouse zona pellucida

Review of boiling heat transfer enhancement on micro/nanostructured surfaces

High-speed visualization of boiling from an enhanced structure

We present a model for the two-phase flow and heat transfer in the closed loop, two-phase thermosyphon (CLTPT) involving co-current natural circulation. The focus is on CLTPTs for electronics cooling that exhibit complex two-phase flow patterns due to the closed loop geometry and small tube size. The present model is based on mass, momentum, and energy balances in the evaporator, rising tube, condenser, and the falling tube. The homogeneous two-phase flow model is used to evaluate the friction pressure drop of the two-phase flow imposed by the available gravitational head through the loop. The saturation temperature dictates both the heat source (chip) temperature and the condenser heat rejection capacity. Thermodynamic constraints are applied to model the saturation temperature, which also depends upon the local heat transfer coefficient and the two-phase flow patterns inside the condenser. The boiling characteristics of the enhanced structure are used to predict the chip temperature. The model is compared with experimental data for dielectric working fluid PF-5060

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

The current study involves two-phase cooling from enhanced structures whose dimensions have been changed systematically using microfabrication techniques. The aim is to optimise the dimensions to maximize the heat transfer. The entranced structure used in this study consists of a stacked network of interconnecting channels making it highly porous. The effect of varying the pore size, pitch and height on the boiling performance was studied, with fluorocarbon FC-72 as the working fluid. While most of the previous studies on the mechanism of enhanced nucleate boiling have focused on a small range of wall superheats (0-4 K), the present study covers a wider range (as high as 30 K) A larger pore and smaller pitch resulted in higher heat dissipation at all heat fluxes. The effect of stacking multiple layers showed a proportional increase in heat dissipation (with additional layers) in a certain range of wall superheat values only. In the wall superheat range 8-13 K, no appreciable difference was observed between a single layer structure and a three layer structure. A fin effect combined with change in the boiling phenomenon within the sub-surface layers is proposed to explain this effect.

Effects of Varying Geometrical Parameters on Boiling From Microfabricated Enhanced Structures

Semi-analytical model for boiling from enhanced structures

Conjugate heat transfer from a surface-mounted block (31 x 31 x 7 mm 3 ) to forced convective air flow (1 - 7 m/s) in a parallel-plate channel was studied experimentally and analytically. Particular attention was directed to the heat flow from the block to the floor through the block support, which was eventually transferred to the air flow over the floor. The concepts of adiabatic wall temperature (T ad ) and adiabatic heat transfer coefficient (h ad ) were employed to account for the effect of thermal wake shed from the block on the heat transfer from the floor. The experimental data of T ad and had were used in setting the boundary condition for the numerical analysis of heat conduction in the floor. The accuracy of the numerical predictions of the thermal conductances for different heat flow paths was proven experimentally. The heat conduction analysis code was then used to find the heat transfer capability qf various block-support/floor combinations.

Wataru Nakayama

Papers

High-speed visualization of boiling from an enhanced structure

A Natural Circulation Model of the Closed Loop, Two-Phase Thermosyphon for Electronics Cooling

Effects of Varying Geometrical Parameters on Boiling From Microfabricated Enhanced Structures

Semi-analytical model for boiling from enhanced structures

Conjugate Heat Transfer From a Single Surface-Mounted Block to Forced Convective Air Flow in a Channel