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Wenjing Sun
Researcher at University of Maine
Publications - 8
Citations - 214
Wenjing Sun is an academic researcher from University of Maine. The author has contributed to research in topics: Mycelium & Ultimate tensile strength. The author has an hindex of 5, co-authored 8 publications receiving 124 citations. Previous affiliations of Wenjing Sun include Beijing Forestry University.
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Journal ArticleDOI
Fully Bio-Based Hybrid Composites Made of Wood, Fungal Mycelium and Cellulose Nanofibrils.
TL;DR: Novel hybrid panel composites based on wood, fungal mycelium, and cellulose nanofibrils (CNF) resulted in enhanced physical and mechanical properties compared to the ones made by physically mixing wood, mycelia, and CNF.
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Correlation between dynamic wetting behavior and chemical components of thermally modified wood
TL;DR: In this article, the dynamic contact angles and droplet volumes of water droplets on modified and unmodified wood surfaces were measured by sessile drop method, and their changing rates (expression index: K value and wetting slope) calculated by wetting models were illustrated for mapping the dynamic wetting process.
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Modification of wood by glutaraldehyde and poly (vinyl alcohol)
TL;DR: In this paper, polyvinyl alcohol (PVA) was introduced to the crosslinking impregnation system of glutaraldehyde (GA) to overcome the mechanical losses of wood after modification.
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Surface properties of in situ organo-montmorillonite modified wood flour and the influence on mechanical properties of composites with polypropylene
TL;DR: In this article, wood flours were modified by Na-MMT and didecyl dimethyl ammonium chloride (DDAC) in two steps to form organo-montmorillonite (OMMT) inside WFs at different OMMT concentrations.
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Functionality of Surface Mycelium Interfaces in Wood Bonding.
TL;DR: Evidence is provided that the bottom surface of the mycelium layer is more hydrophilic, contains more small-scale filamentous structure and contains more functional groups, resulting in better bonding with wood than the top surface.