W
William E. Wilson
Researcher at IBM
Publications - 35
Citations - 542
William E. Wilson is an academic researcher from IBM. The author has contributed to research in topics: Layer (electronics) & Printed circuit board. The author has an hindex of 11, co-authored 35 publications receiving 542 citations. Previous affiliations of William E. Wilson include Warren Wilson College.
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Patent
Composite laminate circuit structure and method of forming the same
TL;DR: In this article, a voltage plane element is provided having at least one voltage plane having opposite faces with layers of partially cured photodielectric material on each face, but completely isolated from the voltage plane.
Patent
Two signal one power plane circuit board
Kenneth Michael Fallon,Miguel A. Jimarez,Ross W. Keesler,John M. Lauffer,Roy H. Magnuson,Voya R. Markovich,Irv Memis,Jim P. Paoletti,Marybeth Perrino,John A. Welsh,William E. Wilson +10 more
TL;DR: In this article, a method of forming a printed circuit board or circuit card is provided with a metal layer which serves as a power plane sandwiched between a pair of photo-imageable dielectric layers.
Patent
Full additive process with filled plated through holes
TL;DR: In this article, a method for additive plating on a subcomposite having filled plated through holes is described, where fine-line circuitry is achieved via electroless deposition onto a dielectric substrate after the through hole is plated and filled.
Patent
Composite laminate circuit structure and methods of interconnecting the same
John M. Lauffer,Voya R. Markovich,Thomas R. Miller,Konstantinos I. Papathomas,William E. Wilson +4 more
TL;DR: In this article, a laminate circuit structure assembly is provided that comprises at least two modularized circuitized plane subassemblies; a joining layer located between each of the sub-assemblies and wherein the subassembly and joining layer are bonded together with a cured dielectric from a bondable, curable dielectrics.
Patent
Filling open through holes in a multilayer board
TL;DR: In this article, a photo-imageable dielectric film is employed to fill the holes in a substrate and to form a dielectrical film above the substrate at the same time.