Showing papers by "Wolfram Wersing published in 1997"
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TL;DR: A planar multi target sputtering approach was used to deposit self polarized PZT films on TiO2/Pt bottom electrodes for the use in thin film pyroelectric IR detector arrays.
Abstract: A planar multi target sputtering approach was used to deposit self polarized PZT films on TiO2/Pt bottom electrodes for the use in thin film pyroelectric IR detector arrays By using elevated substrate temperatures of about 450°C “in situ” growth of tetragonal PZT could be achieved The films exhibited pyroelectric currents without poling The pyroelectric coefficient was 2×10−4 C/m2K, the dielectric constant was 300 and dielectric loss tan δ was 001 The self polarization disappears after heating the sample to 600°C Stresses were studied in the thin film processing for the bottom electrode and the PZT film The TiO2/Pt electrode is under high tensile stress of 900 MPa after preparation PZT has a small compressive stress of -60 MPa, the whole TiO2/Pt/PZT stack has a tensile stress of +80 MPa This low stress level together with the self polarization and the good electrical properties makes the films suitable for the use in pyroelectric detector arrays
46 citations
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TL;DR: In this paper, a planar multi-target sputtering process is used to deposit PZT thin films for application in pyroelectric IR sensors, which are characterized by a pyro electric coefficient p of 2-10−4 Cm−2K−1, a dielectric constant [Sgrave] of 300 and a Dielectric loss tan δ of 0.01.
Abstract: After a short description of thermal conditions in a pyroelectric sensor, substantial requirements to pyroelectric thin film and sensor design are derived from the theoretical basics. A planar multi-target sputtering process is used to deposit PZT thin films for application in pyroelectric IR sensors. The self-polarized PZT are characterized by a pyroelectric coefficient p of 2-10−4 Cm−2K−1, a dielectric constant [Sgrave] of 300 and a dielectric loss tan δ of 0.01. These material properties, including a low tensile stress of the sensor layer stack of + 110 Mpa, as well as standard microelectronic technologies make the films suitable for the use in pyroelectric sensor arrays. Fabricated singleelement sensors have a specific detectivity D* (500K, 10 Hz) of 3.108 cmHz1/2W−1. An 11×6 array sensor has been developed for motion detection. The array pixels with a sensitive area of 0.0784 mm2 have a noise equivalent power NEP of less than 0.7 nW at 1 Hz.
24 citations
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TL;DR: A planar multi target sputtering approach was used to deposit PbTiO3 and Pb(Zr, Ti)O3 (PZT) films on TiO2/Pt bottom electrodes for the use in thin film pyroelectric IR detector arrays as mentioned in this paper.
Abstract: A planar multi target sputtering approach was used to deposit PbTiO3 (PT) and Pb(Zr, Ti)O3 (PZT) films on TiO2/Pt bottom electrodes for the use in thin film pyroelectric IR detector arrays. PZT films with a Zr content of 28 at% (PZ28T) exhibited the best pyroelectric coefficient of typically 2×10−4 Cm−2K−1. The PZ28T films have been used for fabricating a two dimensional 11×6 pixel pyroelectric detector array on Si wafers. The array pixels with a sensitive area of 280 ×280 μm2 have a noise lequivalent power NEP of less than 0.7 nW at 1 Hz. It is planned to use the detector array in systems for motion detection.
19 citations
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28 Oct 1997TL;DR: In this article, a semiconductor detector for infrared radiation is manufactured by depositing an auxiliary layer on a main surface of a carrier, and selectively etching the auxiliary layer through the at least one opening of the membrane layer, so that a hollow space arises in the auxiliary layers.
Abstract: A semiconductor detector for infrared radiation is manufactured by the steps of depositing an auxiliary layer on a main surface of a carrier, depositing a membrane layer provided with at least one opening onto the auxiliary layer, selectively etching the auxiliary layer through the at least one opening of the membrane layer, so that a hollow space arises in the auxiliary layer, sealing the hollow space by depositing a covering on th membrane layer, and fashioning a detector element on the covering by depositing a material sensitive to infrared radiation within a region of the covering that is bounded by the hollow space therebelow.
10 citations