Microstructures and properties of high-entropy alloys

The chemical, physical, and mechanical characteristics of nickel-based superalloys are reviewed with emphasis on the use of this class of materials within turbine engines. The role of major and minor alloying additions in multicomponent commercial cast and wrought superalloys is discussed. Microstructural stability and phases observed during processing and in subsequent elevated-temperature service are summarized. Processing paths and recent advances in processing are addressed. Mechanical properties and deformation mechanisms are reviewed, including tensile properties, creep, fatigue, and cyclic crack growth. I. Introduction N ICKEL-BASED superalloys are an unusual class of metallic materials with an exceptional combination of hightemperature strength, toughness, and resistance to degradation in corrosive or oxidizing environments. These materials are widely used in aircraft and power-generation turbines, rocket engines, and other challenging environments, including nuclear power and chemical processing plants. Intensive alloy and process development activities during the past few decades have resulted in alloys that can tolerate average temperatures of 1050 ◦ C with occasional excursions (or local hot spots near airfoil tips) to temperatures as high as 1200 ◦ C, 1 which is approximately 90% of the melting point of the material. The underlying aspects of microstructure and composition that result in these exceptional properties are briefly reviewed here. Major classes of superalloys that are utilized in gas-turbine engines and the corresponding processes for their production are outlined along with characteristic mechanical and physical properties.

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Nickel-Based Superalloys for Advanced Turbine Engines: Chemistry, Microstructure and Properties

Magnesium alloys have received an increasing interest in the past 12 years for potential applications in the automotive, aircraft, aerospace, and electronic industries. Many of these alloys are strong because of solid-state precipitates that are produced by an age-hardening process. Although some strength improvements of existing magnesium alloys have been made and some novel alloys with improved strength have been developed, the strength level that has been achieved so far is still substantially lower than that obtained in counterpart aluminum alloys. Further improvements in the alloy strength require a better understanding of the structure, morphology, orientation of precipitates, effects of precipitate morphology, and orientation on the strengthening and microstructural factors that are important in controlling the nucleation and growth of these precipitates. In this review, precipitation in most precipitation-hardenable magnesium alloys is reviewed, and its relationship with strengthening is examined. It is demonstrated that the precipitation phenomena in these alloys, especially in the very early stage of the precipitation process, are still far from being well understood, and many fundamental issues remain unsolved even after some extensive and concerted efforts made in the past 12 years. The challenges associated with precipitation hardening and age hardening are identified and discussed, and guidelines are outlined for the rational design and development of higher strength, and ultimately ultrahigh strength, magnesium alloys via precipitation hardening.

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Precipitation and Hardening in Magnesium Alloys

The objective of this review is to study interfacial reactions between pure Sn or Sn-rich solders, and common base metals used in Pb-free electronics production. In particular, the reasons leading to the observed interfacial reactions products and their metallurgical evolution have been analyzed. Results presented in the literature have been critically evaluated with the help of combined thermodynamic–kinetic approach based on the concept of local equilibrium and microstructural knowledge. The following conclusions have been reached: Firstly, the formations of intermetallic compounds in solid/liquid reaction couples are primarily controlled by the dissolution processes of base metals. Other factors that need be considered are the thermodynamic driving force for the formation of intermetallic compounds, their structures and concentration profiles in liquid. Secondly, annealing of solder interconnections in solid state can drastically change the microstructures formed in the solid/liquid reactions, especially if only one of the components in the solder takes part in the interfacial reactions. Thirdly, additional elements can have three major effects on the binary reactions between a base metal and Sn: (i) they can increase or decrease the reaction/growth rates, (ii) the additives can change the physical properties of the phases formed, and (iii) they can form additional reaction products or displace the binary equilibrium phases by forming new reaction products. Finally, if the local stable or metastable equilibrium is established at the interface, stability information together with kinetic considerations can provide a feasible approach to analyze interfacial reactions, which can have significant impact on the reliability of soldered electronics assemblies.

Interfacial reactions between lead-free solders and common base materials

The phase-field method is reviewed against its historical and theoretical background. Starting from Van der Waals considerations on the structure of interfaces in materials the concept of the phase-field method is developed along historical lines. Basic relations are summarized in a comprehensive way. Special emphasis is given to the multi-phase-field method with extension to elastic interactions and fluid flow which allows one to treat multi-grain multi-phase structures in multicomponent materials. Examples are collected demonstrating the applicability of the different variants of the phase-field method in different fields of materials science.

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Phase-field models in materials science

Comment on thermodynamics and lattice disorder in CsC1-phases

The Al−Cu−Sn (Aluminum-Copper-Tin) system

Based on the criteria for the solid state exchange reaction with p-GaN, we have investigated the intermetallic compound NiIn as a possible ohmic contact. The contacts were fabricated by depositing NiIn on p-GaN films (p ∼ 2 × 1017 cm−3) using RF sputtering from a compound target. The as-deposited, NiIn contacts were found to be rectifying and using I-V characterization a Schottky barrier height of 0.82 eV was measured. Rapid thermal annealing of the contacts was shown to significantly decrease their resistance, with contacts annealed at 800 °C for 1 min yielding the lowest resistance. When annealed at 800 °C for 1 min NiIn contacts exhibited a specific contact resistance of 8-9 × 10−3 Ω cm2 as measured by the circular transmission line model. To allow a more universal comparison the more traditional Ni/Au contacts, processed under the same conditions, were used as a standard. Their measured specific contact resistance (ρc = 1.2 − 2.1 × 10−2 Ωcm2) was significantly higher than that of the NiIn contacts. Demonstrating that NiIn has promise as an ohmic contact to p-GaN and should be studied in greater detail.

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Y. A. Chang

Papers

Comment on thermodynamics and lattice disorder in CsC1-phases

The Al−Cu−Sn (Aluminum-Copper-Tin) system

NiIn as an Ohmic Contact to P-GaN

The Growth Rates of Intermediate Phases in Co/Si Diffusion Couples: Bulk Versus Thin-Film Studies

The Al−Cu−Pb (aluminum-copper-lead) system