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Yu Lu
Researcher at Qualcomm
Publications - 12
Citations - 517
Yu Lu is an academic researcher from Qualcomm. The author has contributed to research in topics: Layer (electronics) & Magnetoresistive random-access memory. The author has an hindex of 7, co-authored 12 publications receiving 383 citations.
Papers
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Proceedings ArticleDOI
Pinatubo: a processing-in-memory architecture for bulk bitwise operations in emerging non-volatile memories
TL;DR: This work proposes Pinatubo, a Processing In Non-volatile memory ArchiTecture for bUlk Bitwise Operations, which redesigns the read circuitry so that it can compute the bitwise logic of two or more memory rows very efficiently, and support one-step multi-row operations.
Proceedings ArticleDOI
Architecture design with STT-RAM: Opportunities and challenges
TL;DR: This paper introduces state-of-the-art architectural approaches to adopt STT-RAM in the cache and memory system design by taking advantage of the opportunities brought by STt-RAM as well as overcoming the challenges.
Patent
Mram integration techniques for technology
Xia Li,Yu Lu,Seung H. Kang +2 more
TL;DR: In this paper, a magnetoresistive random access memory (MRAM) integration compatible with shrinking device technologies includes a magnetic tunnel junction (MTJ) formed in a common interlayer metal dielectric (IMD) layer with one or more logic elements.
Journal ArticleDOI
LAP: loop-block aware inclusion properties for energy-efficient asymmetric last level caches
TL;DR: This work proposes a novel selective inclusion policy, Loop-block-Aware Policy (LAP), to reduce energy consumption in LLCs with asymmetric read/write properties, and extends LAP to a system with SRAM/STT-RAM hybrid LLCs to achieve energy-efficient data placement.
Patent
Magnetic tunnel junction and method for fabricating a magnetic tunnel junction
TL;DR: An improved magnetic tunnel junction (MTJ) device and methods for fabricating the improved MTJ device are provided in this paper. The provided two-etch process reduces etching damage and ablated material redeposition, and the method also includes forming a top electrode on the free layer, as well as forming a hardmask layer on the top electrode.