An introduction to heat transfer

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Numerical Heat Transfer And Fluid Flow

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

An Introduction to Magnetohydrodynamics

Geometry: shape, size, aspect ratio and orientation Flow Type: forced, natural, laminar, turbulent, internal, external Boundary: isothermal (Tw = constant) or isoflux (q̇w = constant) Fluid Type: viscous oil, water, gases or liquid metals Properties: all properties determined at film temperature Tf = (Tw + T∞)/2 Note: ρ and ν ∝ 1/Patm ⇒ see Q12-40 density: ρ ((kg/m) specific heat: Cp (J/kg ·K) dynamic viscosity: μ, (N · s/m) kinematic viscosity: ν ≡ μ/ρ (m/s) thermal conductivity: k, (W/m ·K) thermal diffusivity: α, ≡ k/(ρ · Cp) (m/s) Prandtl number: Pr, ≡ ν/α (−−) volumetric compressibility: β, (1/K)

Convection Heat Transfer

Data reduction of average friction factor of gas flow through adiabatic micro-channels

Electromagnetic simulation of low-gravity environment has been numerically investigated to study the transport phenomena associated with melting of an unfixed and electrically conducting phase-change material (PCM) inside a rectangular enclosure. Electromagnetic fields are configured such that the resulting Lorentz force can be used to damp and/or counteract the natural convection as well as the flow induced by sedimentation and/or floatation, thereby simulating the low-gravity environment of outer space. The governing equations are discretized using a control-volume-based finite-difference scheme. Numerical solutions are obtained for true low-gravity environment as well as for the simulated low-gravity conditions due to electromagnetic forces. The results show that when the Lorentz force is caused by the presence of magnetic field alone, the low-gravity condition is simulated by the magnetic damping effect, which is shown to have a profound effect on the flow field. On the other hand, it is shown that un...

Numerical solution of melting processes for unfixed phase-change material in the presence of electromagnetically simulated low gravity

Two-dimensional compressible momentum and energy equations are solved numerically to obtain the heat transfer characteristics of gaseous flow in a micro-tube with isothermal wall. The numerical methodology is based on the Arbitrary-Lagrangian-Eulerian (ALE) method. The stagnation temperature is fixed at 300 K and the computations were done for the wall temperatures of 305 K, 310 K and 350 K. The bulk temperature based on the static temperature is compared with that of the incompressible flow in a conventional sized tube. The static bulk temperature of the gaseous flow in a micro-tube decreases approaching to the outlet due to the energy conversion into the kinetic energy, when flow is fast. The total temperatures are also compared witht he bulk temperature of the incompressible flow in a conventional sized tube. The total temperature is slightly higher than the bulk temperature of the incompressible flow. This is due to the additional heat transfer near the outlet. A correlation for the prediction of the heat transfer rate of the gaseous flow in the micro tube is proposed.Copyright © 2004 by ASME

Heat Transfer Characteristics of Gaseous Flow in a Micro-Tube

Heat Transfer Characteristics of Compressible Laminar Flow Through Microtubes

A review on numerical simulations performed for solidification and melting process of nano-enhanced phase change materials (NEPCM) is reported. The studies were conducted to understand the factors influencing the process such as nanoparticle fraction in the mixture, nanoparticle size and shape, boundary conditions imposed and container and fin geometry. Then, common nanoparticles applied in the studies were highlighted. The numerical models applied to simulate the problems were next presented. Finally, the thermophysical properties predicted and applied in the numerical works were compared. It was found that copper was the most applied nanoparticle in the numerical simulations. Most researchers applied enthalpy-porosity formulation coupled with finite volume method to perform the simulations. This method was preferred because it is relatively simpler compared to multidomain approach and mesoscale methods. Regardless of the chosen method, most researchers used a single thermophysical property value for the NEPCM in both solid and liquid regions. Brinkman and Maxwell correlations were mostly used to approximate the dynamic viscosity and thermal conductivity of the NEPCM, respectively. It is essential to understand the limitations and to select the most suitable thermophysical properties correlation to be applied in the numerical simulations to ensure that the final results will be acceptable and deviation from experimental works is effectively suppressed.

Yutaka Asako

Papers

Data reduction of average friction factor of gas flow through adiabatic micro-channels

Numerical solution of melting processes for unfixed phase-change material in the presence of electromagnetically simulated low gravity

Heat Transfer Characteristics of Gaseous Flow in a Micro-Tube

Heat Transfer Characteristics of Compressible Laminar Flow Through Microtubes

Review on numerical simulations for nano-enhanced phase change material (NEPCM) phase change process