An introduction to heat transfer

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Numerical Heat Transfer And Fluid Flow

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

An Introduction to Magnetohydrodynamics

Geometry: shape, size, aspect ratio and orientation Flow Type: forced, natural, laminar, turbulent, internal, external Boundary: isothermal (Tw = constant) or isoflux (q̇w = constant) Fluid Type: viscous oil, water, gases or liquid metals Properties: all properties determined at film temperature Tf = (Tw + T∞)/2 Note: ρ and ν ∝ 1/Patm ⇒ see Q12-40 density: ρ ((kg/m) specific heat: Cp (J/kg ·K) dynamic viscosity: μ, (N · s/m) kinematic viscosity: ν ≡ μ/ρ (m/s) thermal conductivity: k, (W/m ·K) thermal diffusivity: α, ≡ k/(ρ · Cp) (m/s) Prandtl number: Pr, ≡ ν/α (−−) volumetric compressibility: β, (1/K)

Convection Heat Transfer

Convection heat transfer in concentric micro annular tubes with constant wall temperature

Periodic fully developed fluid flow and heat transfer characteristics are obtained numerically for turbulent flow over a three-dimensional array of heated square blocks deployed along one wall of a parallel-plate duct. This configuration simulates forced convection cooling of electronic equipment. The Lam-Bremhorst low-Reynolds-number form of the k - ∊ model is used for the computations. The computations are performed for a set of geometric parameters characterizing the array, for a range of Reynolds numbers from 103 to 104, for a Prandtl number of 0.7, and for a condition of uniform wall temperature. The results are compared with relevant experimental data from the literature and also with the numerical values obtained by using the high-Reynolds-number form of the k - ∊ turbulence model.

Prediction of turbulent three-dimensional heat transfer of heated blocks using low-reynolds number two-equation model

Three-dimensional natural convection heat transfer characteristics in a vertical air layer partitioned into cubical enclosures by partition walls of finite thermal conductivity and finite thickness were obtained numerically. The air layer is differentially heated from each surface. In this work, the analyses were performed using finite thickness and finite conductivity of the partition wall for Ra = 10 4 and 10 5 , and for wide range of the thickness and the conductivity of the partition wall. The results were presented in the form of overall convection and total heat transfer coefficient. From the comparison of the results with the traditional ideal boundary conditions such as conduction, adiabatic, and no-thickness, the correlation of the heat transfer with the actual partition wall and the ideal boundary conditions were developed. After examinations of the results, it was shown that the proportion of the heat transfer quantity in the partition wall to the total heat transfer quantity from the hot wall is a function of a product of the thermal conductivity and the thickness of the partition wall.

Effect of Partition Wall on Natural Convection Heat Transfer in a Vertical Air Layer

Heat transfer performance of two-stream parallel and counter-flow gas-to-gas micro-heat exchangers are investigated numerically. Flow passages are plane channels with heights in the range of 10-100 μm and selected lengths of 12.7 mm and 25.4 mm. Numerical methodology is based on the arbitrary-Lagrangian-Eulerian method. Computations were performed to find the effects of capacity ratio, channel height, and length on the heat transfer characteristics of micro-heat exchangers. To results are presented in the form of temperature contours, bulk temperatures, total temperatures, and heat flux variation along the channel. It was found that the temperature inversion occurs under certain conditions. Also, the effectiveness and the number of transfer units approach and the estimation of the heat exchange rate were discussed. The range of parameters where the predicted effectiveness agrees with the numerical result were investigated.

Performance of Gas-to-Gas Micro-Heat Exchangers

We present an experimental investigation of convective heat transfer for laminar gas flow through a microchannel. A test stand was set up to impose thermal boundary conditions of constant temperature gradient along the microchannel length. Additionally, thin film temperature sensors were developed and used to directly measure the microchannel surface temperature. Heat transfer experiments were conducted with laminar nitrogen gas flow, in which the outlet Ma was between 0.10 and 0.42. The experimental measurements of inlet and outlet gas temperature and the microchannel wall temperature were used to validate a two-dimensional numerical model for gaseous flow in microchannel. The model was then used to determine local values of Ma, Re, and Nu

Yutaka Asako

Papers

Convection heat transfer in concentric micro annular tubes with constant wall temperature

Prediction of turbulent three-dimensional heat transfer of heated blocks using low-reynolds number two-equation model

Effect of Partition Wall on Natural Convection Heat Transfer in a Vertical Air Layer

Performance of Gas-to-Gas Micro-Heat Exchangers

Convection Heat Transfer in Microchannels With High Speed Gas Flow