An introduction to heat transfer

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Numerical Heat Transfer And Fluid Flow

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

An Introduction to Magnetohydrodynamics

Geometry: shape, size, aspect ratio and orientation Flow Type: forced, natural, laminar, turbulent, internal, external Boundary: isothermal (Tw = constant) or isoflux (q̇w = constant) Fluid Type: viscous oil, water, gases or liquid metals Properties: all properties determined at film temperature Tf = (Tw + T∞)/2 Note: ρ and ν ∝ 1/Patm ⇒ see Q12-40 density: ρ ((kg/m) specific heat: Cp (J/kg ·K) dynamic viscosity: μ, (N · s/m) kinematic viscosity: ν ≡ μ/ρ (m/s) thermal conductivity: k, (W/m ·K) thermal diffusivity: α, ≡ k/(ρ · Cp) (m/s) Prandtl number: Pr, ≡ ν/α (−−) volumetric compressibility: β, (1/K)

Convection Heat Transfer

Three dimensional heat transfer and fluid flow characteristics in the entrance region of ducts of arbitrary cross-section.

Dissipative particle dynamics (DPD) with energy conservation was applied to simulate forced convection in parallel-plate channels with boundary conditions of constant wall temperature (CWT) and constant wall heat flux (CHF). DPD is a coarse-grained version of molecular dynamics. An additional governing equation for energy conservation was solved along with conventional DPD equations where inter-particle heat flux accounts for changes in mechanical and internal energies when particles interact with surrounding particles. The solution domain was considered to be two-dimensional with periodic boundary condition in the flow direction. Additional layers of particles on top and bottom of the channel were utilized to apply no-slip velocity and temperature boundary conditions. The governing equations for energy conservation were modified based on periodic fully developed velocity and temperature conditions. The results were shown via velocity and temperature profiles across the channel cross section. The Nusselt numbers were calculated from the temperature gradient at the wall using a second order accurate forward difference approximation. The results agreed well with the exact solutions to within 2.3%.Copyright © 2011 by ASME

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Forced convection heat transfer simulation using dissipative particle dynamics with energy conservation

In this paper, a low gravity environment has been simulated numerically, via an electromagnetic field, by studying the transport phenomena associated with the melting of an electrically conducting phase change material (gallium) inside a three-dimensional enclosure. Both transverse electric and magnetic fields are used to generate a Lorentz force, which is used to counteract the effects of gravity and thus simulate low gravity. The problem is formulated as one-domain by employing an enthalpy-based transformation of the energy equation. The governing equations are then discretized using a control-volume-based finite difference scheme. The results show that the application of an electromagnetic filed can be used to simulate key melting characteristics found for actual low gravity. However, the resulting three-dimensional flow field in the melted region differs from actual low gravity. The application of an electromagnetic field creates a flow phenomenon not found in actual low gravity or previously seen in two-dimensional problems. While these distortions do exist when an electromagnetic field is applied, their intensity is significantly lower than the distortions are found when only a magnetic filed is applied. Since these distortions are of much lower intensity, it can be said that low gravity can be simulated better by an electromagnetic field.Copyright © 2004 by ASME

Phase Change in a Three-Dimensional Rectangular Cavity Under Electromagnetically Simulated Low Gravity: Side Wall Heating

Heat Transfer Characteristics of a Gas-Gas Counterflow Microchannel Heat Exchanger

This paper presents experimental results on flow characteristics of laminar, transitional to turbulent gas flows through micro-channels. The experiments were performed for three micro-channels. The micro-channels were etched into silicon wafers, capped with glass, and their hydraulic diameter are 69.48, 99.36 and 147.76 μm. The pressure was measured at seven locations along the channel length to determine local values of Mach number and friction factor for a wide range of flow regime from laminar to turbulent flow. Flow characteristics in transitional flow regime to turbulence were obtained. The result shows that f·Re is a function of Mach number and higher than incompressible value due to the compressibility effect. The values of f·Re were compared with f·Re correlations in available literature.Copyright © 2010 by ASME

Yutaka Asako

Papers

Three dimensional heat transfer and fluid flow characteristics in the entrance region of ducts of arbitrary cross-section.

Forced convection heat transfer simulation using dissipative particle dynamics with energy conservation

Phase Change in a Three-Dimensional Rectangular Cavity Under Electromagnetically Simulated Low Gravity: Side Wall Heating

Heat Transfer Characteristics of a Gas-Gas Counterflow Microchannel Heat Exchanger

Experimental Investigations of Laminar, Transitional to Turbulent Gas Flow in a Micro-Channel