Showing papers by "Samsung published in 1995"

Adaptive median filters: new algorithms and results

Abstract: Based on two types of image models corrupted by impulse noise, we propose two new algorithms for adaptive median filters. They have variable window size for removal of impulses while preserving sharpness. The first one, called the ranked-order based adaptive median filter (RAMF), is based on a test for the presence of impulses in the center pixel itself followed by a test for the presence of residual impulses in the median filter output. The second one, called the impulse size based adaptive median filter (SAMF), is based on the detection of the size of the impulse noise. It is shown that the RAMF is superior to the nonlinear mean L/sub p/ filter in removing positive and negative impulses while simultaneously preserving sharpness; the SAMF is superior to Lin's (1988) adaptive scheme because it is simpler with better performance in removing the high density impulsive noise as well as nonimpulsive noise and in preserving the fine details. Simulations on standard images confirm that these algorithms are superior to standard median filters. >

The implementation of business process reengineering

Abstract: As more organizations undertake business process reengineering (BPR), issues in implementing BPR projects become a major concern. This field research seeks empirically to explore the problems of implementing reengineering projects and how the severity of these problems relates to BPR project success. Based on past theories and research related to the implementation of organizational change as well as field experience of reengineering experts, a comprehensive list of sixty-four BPR implementation problems was identified. The severity of each problem was then rated by those who have participated in reengineering in 105 organizations. Analysis of the results clearly demonstrates the central importance of change management in BPR implementation success. Resolutions of problems in other areas such as technological competence and project planning were also determined to be necessary, but not sufficient, conditions for reengineering success. Further, problems that are more directly related to the conduct of a project such as process delineation, project management, and tactical planning were perceived as less difficult, yet highly related to project success. This situation was also true for human resource problems such as training personnel for the redesigned process. These findings suggest that reengineering project implementation is complex, involving many factors. To succeed, it is essential that change be managed and that balanced attention be paid to all identified factors, including those that are more contextual (e.g., management support and technological competence) as well as factors that pertain directly to the conduct of the project (e.g., project management and process delineation). As one of the first pieces of empirical evidence based on a field study, this research emphasizes the importance of addressing BPR implementation within the broader context of organizational change in a complex sociotechnical environment.

Method for reducing unnecessary traffic over a computer network

Abstract: Standard protocols, such as those commonly used on LAN networks, are used to connect nodes to an enterprise network via a wide area wireless network. Within the appropriate protocol stacks, the standard protocols are optimized by filtering some packets, eliminating and reducing the size of other fields and substituting still other fields to reduce the size of the data packets. The optimized data packets can be transmitted over the wireless WAN increasing WAN efficiency. The optimization is accomplished by inserting an additional optimization layer into the protocol stack between the existing layers. The optimization layer accepts the normal protocol signals generated by the surrounding layers and generates outputs which mimic protocol layers which the surrounding layers expect. Consequently, the optimization layer operates transparently with respect to the existing protocol stack layers.

Method for manufacturing a semiconductor package

Abstract: A method for manufacturing a semiconductor package, including providing a lead frame in which die pad and side rail areas of the lead frame are mechanically interconnected to, and electrically isolated from each other so that the exposed bottom surface of the die pad does not become coated with a metal plating film during surface treatment for coating outer leads of the lead frame.

Large area tiled modular display system

Abstract: A tiled flat-panel modular display system includes an array of display modules (100) which contain thin seal liquid crystal displays Each of a plurality of module alignment devices (320) attach a respective display module (100) to a large base plate (310) A frame is connected to the base plate and surrounds the base plate and display modules A global cover glass assembly (330) disposed above the display modules encloses and protects the display modules Included in each of the display modules (100) is a light source configuration (340) of a light box and a light box cover which utilizes global light sources that provide efficient uniform backlighting of the corresponding display The alignment devices (320) permit alignment of the display modules (100) with respect to each other and to a global black mask disposed in the global cover glass assembly (330) to achieve a display system that is seamless in appearance The tiled display system further utilizes compensation electronics to achieve uniform contrast and transmission characteristics in each of the thin seal displays In addition, the display system utilizes display circuitry that achieves an improvement in optical performance over conventional displays

High thermal emissive semiconductor device package

Abstract: Disclosed herein is a high thermal emissive semiconductor device package which comprises a substrate having a plurality of external connection leads, a plurality of connection lands and wires between the leads and the lands; at least one semiconductor chips mounted on the substrate; bonding wires electrically connecting bonding pads of the chip and the connection lands of the substrate; a heat spreader with high thermal conductivity, which is attached to the upper surface of the bonding pads of the chip by insulating adhesives with good thermal conductivity; and a metal cap which is in contact with the upper surface of the heat spreader via thermal compounds and encapsulates the whole components by being sealed to the substrate. The high thermal emissive semiconductor device packages have advantageous that they efficiently emit heat generated during the operation of components and that they may be applied to various semiconductor devices which can be produced at low costs.

Guaranty Funds and Risktaking: Evidence from the Insurance Industry

Abstract: This paper examines changes in property-liability insurers risktaking associated with the enactment of state guaranty fund laws. We present evidence that the risk of insurers' asset portfolios increased following enactments. But the increase in risk is significant only for stock insurers. This evidence of increased asset risk following guarantee-fund adoptions helps explain the increase in insurer insolvencies in recent years.

Semiconductor assembly for a three-dimensional integrated circuit package

Abstract: A semiconductor package assembly includes recessed edge portions extending along at least one edge portion of the assembly and an upper surface of leads being exposed therefrom, a top recess portion disposed on a top surface of the assembly, and a bottom recess portion disposed on a bottom surface of the assembly. When the assemblies are used in fabricating a three-dimensional integrated circuit module, the recessed edge portions accommodates leads belonging to an upper semiconductor assembly to achieve electrical interconnection therebetween, the top recess portion and the bottom recess portion belonging to an upper semiconductor assembly form a space to accommodate a heat sink or a capacitor plate.

Apparatus for variable-length coding and variable-length-decoding using a plurality of Huffman coding tables

Abstract: An apparatus for variable-length-coding input symbols using a plurality of variable-length-code tables includes N variable-length-code tables each having a symbol-codeword association different from the others according to statistics regarding the symbols and a variable-length-coding device for coding the input symbols according to each of the variable-length-code tables for every block in a predetermined block data unit, for generating codewords, and for providing both table information representing each of the variable-length-code tables utilized in generating the respective codewords and a control signal indicating that variable-length-coding to a predetermined block data unit has been completed. The apparatus also includes buffers which store the codewords generated by the variable-length-coding device, an optimum table determining device receiving the output codewords for controlling the buffer so as to output codewords with a minimum amount of data for the block data unit, for supplying the table information from the variable-length-coding device and for providing table selection information representing a variable-length-code table producing the minimum amount of data for an input block data unit. The apparatus further includes a first switching circuit which receives table selection information and codewords and respectively outputs data in response to the output control signal. The apparatus advantageously can improve data compression efficiency. A complementary decoder, which can be used in building a communication system, is also described.

Remote control method and apparatus thereof

Abstract: A remote control method and apparatus for a remote controller having a touch panel as an input device, performs a remote control operation of an image apparatus, such as a television, either by inputting a character onto the touch panel or by controlling a cursor according to the contact location of a finger or a pen contacting the touch panel. The input character or contacting the touch panel to control a cursor, are used to select a function shown on a menu screen displayed on the image apparatus. The selection is made according to the movement of the cursor, causing the image apparatus to perform the function corresponding to either the character input onto the touch panel or the function selected by the cursor. The result of employing a touch screen is to reduce the number of keys of the remote controller and, thus, perform the desired function more easily.

Information input apparatus having functions of both touch panel and digitizer, and driving method thereof

Abstract: An information input apparatus having both functions of touch panel and digitizer is disclosed including a stylus pen for applying a power source and for touching, a panel having upper and lower substrates, a first resistive layer formed on the upper substrate, a second resistive layer formed on the lower substrate, and a spacer for maintaining a predetermined distance and insulation between the first and second resistive layers, and mode selection means for selectively switching between ground and a power source for contact with the second resistive layer, to thereby select an operation mode for operating the panel as a touch panel or digitizer.

Data transmitter and receiver of a spread spectrum communication system using a pilot channel

Abstract: An improved spread spectrum communication system includes a transmitter and a receiver utilizing a pilot channel for the transmission of pure rather than modulated PN codes for code acquisition or tracking purposes with a lower bit error rate. The pilot signal is used to obtain initial system synchronization and phase tracking of the transmitted spread spectrum signal. At the transmitter side, Walsh an orthogonal code generator, a Walsh modulator, a first PN code generator, a first band spreader, a second band spreader, finite impulse response filters, digital-to-analog converter, low-pass filters, an intermediate frequency mixer, a carrier mixer, a band-pass filter are used to transmit a spread spectrum signal. At the receiver side, a corresponding band-pass filter, a carrier mixer, an intermediate-frequency mixer, low-pass filters, analog-digital converters, a second PN code generator, an I channel despreader, a Q channel despreader, a PN code synchronization controller, a Walsh an orthogonalcode generator, a first Walsh demodulator, a second Walsh demodulator, accumulator & dump circuits, a combiner, and a data decider are used to demodulate a received spread spectrum signal.

Semiconductor multi-package stack

Abstract: A stacked semiconductor multi-package including a plurality of individual semiconductor chip packages stacked over one another. The individual packages have a substrate provided with a plurality of bonding pads, electrode pads electrically connected to the bonding pads through wires, and chips attached to upper and lower surfaces of the substrate. A paddles lead frame is provided onto which the individual packages are attached to upper and lower surfaces thereof, and variants thereof. For these packages, since individual packages are mounted on upper and lower surfaces of a single printed circuit board or lead frame, the mounting density can be significantly increased and their production can be simplified.

Method for forming oxide protective film on bonding pads of semiconductor chips by UV/O3 treatment

Abstract: A method for forming a protective oxide film on the bonding pads of a semiconductor chip which is to be encapsulated by a molded-in-place capsule of plastic material including exposing a chip having bonding pads (while the chip is in the form of wafer), to O 3 and ultraviolet (UV) radiation, so that excited oxygen generated from the O 3 by UV radiation oxidizes metal atoms, for example aluminum atom of the aluminum bonding pads, to form a fine oxide film over the bonding pads, this film providing protection from water and/or ions which would otherwise cause corrosion of the bonding pads.

Drive control method of robotic vacuum cleaner

Abstract: A self-propelled robotic vacuum cleaner includes independently driven right and left drive wheels, a front sensor emitting ultrasonic waves in a forward direction as the front sensor is oscillated right and left by 180°, and a rear sensor emitting ultrasonic waves in a lateral direction. The ultrasonic waves from the front sensor determine the presence of obstacles in front of the cleaner. The ultrasonic waves from the front and rear sensors together determine a distance between the cleaner and an adjacent wall, as well as an angle formed between the wall and a direction of travel of the cleaner. The respective speeds of the right and left drive wheels are controlled to keep the travel path of the cleaner parallel to the wall and at a predetermined distance therefrom whenever no obstacle is sensed.

Implementation of a passive automatic focusing algorithm for digital still camera

Abstract: A passive AF algorithm for the digital still camera is proposed. As a class of hybrid processing techniques, the proposed algorithm utilizes the two different focus measures by which the best focused image is extracted via two stages. With the paraxial geometric optics model of image formation, some well-known focus measures are investigated and a robust focusing algorithm is designed based on them. The proposed algorithm has been successfully tested on a prototype digital still camera. >

Charge induction apparatus of robot cleaner and method thereof

Abstract: The present invention relates to a charging apparatus for a robot cleaner and a method for charging the robot cleaner by which the robot cleaner can be accurately induced to a power source supplier to receive a battery charge when a battery power source drops below a predetermined level. The apparatus includes a control unit for controlling an overall operation, a memory which stores a driving program including structures for various rooms for which cleaning operations may be performed, and a driving unit for moving the robot cleaner in forward, reverse, left and right directions according to control signals of the control unit. A travel distance detecting unit is provided for detecting a travel distance covered by the driving unit and a travel direction detecting unit is provided for detecting a travel direction varied by the driving unit. An obstacle detecting unit is also provided for detecting whether or not there is an obstacle with a cleaning area and for detecting a distance to the obstacle from the cleaner. A charged level detecting unit detects a charge voltage level of a battery and an electric power source supplier is provided for charging the battery to above a predetermined level when the charge voltage level of the battery detected by the charge level detecting unit drops below the predetermined level. An electric power source receiving unit is also provided for electrically connecting the electric power source supplier to the battery so that the power source supplied from the electric power source supplier can be applied to charge the battery.

Component-based icon construction and customization system

Abstract: System and method for constructing and customizing icons for use in a graphical user interface (GUI) is disclosed. A GUI is provided with a set of available user interface components that may be selected and combined by a user to create new icons or to modify existing icons. Each icon comprises a plurality of components and each component may be represented by a set of primitives, or component objects. With respect to each component, a user may select an object from the set of objects to represent the component and the selected objects are combined to create a coherent icon used for representing applications, functions and documents in an operating system or applications program. The combination of the component objects is performed based on sets of rules associated with the individual components, which rules dictate the positioning, scaling, graphical combination and available coloring of the component. In this manner, the creation and modification of icons is accomplished by manipulating objects, rather than bits.

Adaptive power allocating method and apparatus for multicarrier transmission system

Abstract: An original data signal is transmitted by a predetermined transmission power, the data signal distorted during transmission is received, and the received signal is output after being restored to the original data signal, the SNR for each subchannel is calculated and a higher power is allocated to a subchannel having a higher SNR and a lower power is allocated to a subchannel having a lower SNR. If the transmission power of each subchannel exceeds a maximum limit, the maximum limit is redetermined as the transmission power of the subchannels whose transmission power exceeds the maximum limit. Then, the transmission power of a subchannel whose SNR is negative is determined if the transmission power of each subchannel does not exceed the maximum limit or the above redetermination step is completed. Thereafter, the transmission power of each subchannel is controlled to the determined power. As a result, the data transmission efficiency is increased and the power is not allocated near the subchannel having negative SNR value, to thereby prevent power loss.

Deemphasis and subsequent reemphasis of high-energy reversed-spectrum components of a folded video signal

Abstract: A system for reproducing a luminance signal from a medium containing a previously recorded luminance signal with a high-frequency portion thereof compressed in dynamic range includes a circuit for recovering that luminance signal from the medium. Filtering is done to separate the low-frequency and compressed-in-dynamic-range high-frequency portions of the recovered luminance signal from each other. A corer responds to the separated compressed-in-dynamic-range high-frequency portion of the recovered luminance signal to provide a cored high-frequency portion with expanded dynamic range and reduced noise. The level of the cored high-frequency portion with expanded dynamic range and reduced noise is then boosted by a predetermined amount to compensate for energy losses during the compression of the dynamic range and added back to the low-frequency portion of the recovered luminance signal to reproduce a full-band luminance signal with at least partially restored dynamic range for high-frequencies and without readily visible high-frequency noise.

Method of maufacturing a semiconductor device having a low resistance gate electrode

Abstract: A method for manufacturing a semiconductor device, e.g., an LDD transistor, which includes the steps of forming a gate insulating layer on a semiconductor substrate, forming a polysilicon layer on the gate insulating layer, forming a silicide layer on the polysilicon layer, etching the silicide layer to form a gate-patterned silicide layer, and over-etching the silicide layer to partially etch the polysilicon layer, to thereby form a step in the polysilicon layer, forming an oxidation-prevention spacer on sidewalls of the gate-patterned silicide layer and sidewalls of the polysilicon layer exposed by the step, etching the polysilicon layer, using the oxidation-prevention spacer as an etching mask, to thereby form a gate-patterned polysilicon layer, the gate-patterned silicide layer and the gate-patterned polysilicon layer together comprising a gate electrode, thermally oxidizing exposed portions of the gate insulating layer and exposed portions of the polysilicon layer, to thereby form an oxide layer, and, ion-implanting impurities into the semiconductor substrate, using the resultant structure as an ion-implantation mask, to thereby form source/drain regions in the semiconductor substrate, on opposite sides of the gate electrode.

Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices

Abstract: A rotatable and slidable heat pipe apparatus for transferring heat away from a microprocessor chip more rapidly than by heat sink surface area dissipation to the surrounding air alone, comprising a heat sink with an integral cylindrical passageway adapted to receive a first end of a heat pipe shaped like a crankshaft, and a heat spreader formed from a metal plate with a first end rolled up to define a cylindrical opening adapted to receive a second end of the heat pipe. The heat spreader is attached to an underside of a keyboard. Since the heat pipe is able to rotate within the cylindrical passageway and the cylindrical opening, the keyboard can be raised to an open position and lowered to a closed position quickly and simply without the risk of breaking or bending the heat pipe, and manufacturing position tolerances between the heat pipe apparatus components are increased resulting in a simplified manufacturing process. The heat pipe can also be slid in to and out of the cylindrical passageway or the cylindrical opening, thereby enabling computer manufacturers to incorporate the heat pipe into portable battery powered notebook-type computer systems designed to allow a user to remove, replace, or swap internal components by simply flipping open or removing the keyboard, and further enabling a user to perform maintenance work or repairs on the computer system without concern for damage to the heat pipe.

Reduced noise semiconductor package stack

Abstract: A semiconductor package stack assembly providing reduced electrical noise, in which a conductive film is provided on an exposed bottom surface of the semiconductor chip of each semiconductor package in a unitary stack thereof, each conductive film being grounded to ground lines of the printed circuit board on which the lowermost package of the stack is surface-mounted.

Process for formation of thin film transistor liquid crystal display

Abstract: A process for formation of a thin film transistor liquid crystal display is disclosed, in which an etch-back type 3-mask process or an etch stopper type 4-mask process is applied, so that the semiconductor layer of the thin film transistor can be isolated from the data line. Consequently, the optical leakage current which aggravates the performance of the transistor is inhibited. Further, the data line is composed of a material which has a low chemical reactivity with ITO, so that a corrosion due to a chemical reaction between the data line and ITO can be eliminated.

IC card for credit transactions and credit transaction apparatus and method using the same

Abstract: An IC card for credit transactions and a credit transactions apparatus and method using the IC card are provided. In an IC card for credit transactions includes a data memory portion and a controlling portion for reading out or recording data in the data memory portion, the data memory portion includes a user information area for recording information on the identification of a user, a transaction limit information area for recording information on the off-line transaction limit of the user, and a transaction particulars information area being divided into a plurality of sub-areas and for recording information on the transaction particulars of the user. Transactions using the credit card within the usage limit range set according to the credit rating of a customer are processed off-line, so as to reduce not only the load applied to the host system of the credit card company caused by the on-line transaction but also the time delay by the transaction approval, while minimizing losses (due to non-payment) of a credit card company and retail outlets caused by off-line usage by additionally recording special information on the IC card, such as delinquent payments, to restrict off-line credit transactions.

Lamp control circuit having a brightness condition controller having 2.sup.nrd and 4th current paths

Abstract: A back light circuit for a liquid crystal display (LCD) includes: an alternating current (AC) adapter, a battery for supplying a direct current (DC) when the alternating current (AC) adapter is not used, an adapter detecting unit for determining whether or not the alternating current (AC) adapter is being used, a direct current/direct current (DC/DC) converter for providing output of a switched signal, a direct current/alternating current (DC/AC) converter for driving a cold cathode fluorescent lamp (CCFL) by increasing an electric potential, a cold cathode fluorescent lamp (CCFL) operated by the direct current/alternating current (DC/AC) converter, an on/off controller for controlling the direct current/direct current (DC/DC) converter, a brightness controller for controlling the brightness of the cold cathode fluorescent lamp (CCFL), a feedback unit for providing feed back signals to the direct current/direct current (DC/DC) converter, a brightness condition detector for determining the brightness condition of the back-light of the liquid crystal display (LCD), a low battery/very low battery (LB/LLB) signal transmitter for generating a signal indicating the residual amount of battery power when the battery is being used, and a brightness condition controller for determining a brightness condition of the back light of the liquid crystal display (LCD). The back light of the liquid crystal display (LCD) is adjusted based on the condition of the battery, and further based on whether the alternating current (AC) adapter is being used.

Network hibernation system for suspending and resuming operation of computer system operable in network environment in event of power failure or period of inactivity

Abstract: A network hibernation system for use with a computer connected to a local area network. (LAN) which is capable of retaining both data from the computer and data from the network environment created in connection with the LAN in the event of a power failure and also in the event that the computer is idle for a predetermined time period. Upon the restoration of power, the states of the computer and network hibernation system are resumed to the point before the occurrence of the power failure or the idle period. The system includes a network interface for connecting the computer to the local area network; a power controller connected to a data bus, for generating a time-out signal when the computer is in a non-use state during operation of the computer; a power supply connected to the data bus, for generating a power interrupt detection signal upon abrupt termination of a main power source to provide back-up power to the computer system for backing data of the computer in a network environment, and for terminating the back-up power upon reception of a power interrupt signal; a supplemental memory for storing data of the computer in the network environment; a system controller connected to the data bus, for controlling data of the computer in the network environment to be stored in the supplemental memory, for generating the power interrupt signal after the data of the computer in the network environment are stored in the supplemental memory in response to either the time-out signal or the power interrupt detection signal to set the computer in a network hibernation state, and for recovering stored data and restoring the computer in the network environment when the main power source is re-supplied to the computer; and a main memory for storing network hibernation information for the system controller to determine whether the computer is in the network hibernation state.

Semiconductor device having a multi-layer metallization structure

Abstract: The invention relates to a wiring structure for a semiconductor device and a method for manufacturing the same, which fills up a contact hole of below one half micron. An insulating layer is formed on a semiconductor substrate, and a contact hole is formed in the insulating layer. On the insulating layer, a first metal is deposited via a CVD method to form a CVD metal layer or a CVD metal plug filling up the contact hole. Then, the thus-obtained CVD metal layer or the CVD metal plus is heat-treated in a vacuum at a high temperature below the melting point of the first metal, thereby planarizing the surface of the CVD metal layer. A second metal is deposited via a sputtering method on the CVD metal layer or on the CVD metal plug to thereby form a sputtered metal layer. The contact hole is filled up with the first metal by the CVD method and then a reliable sputtered metal layer is deposited via a sputtering method. The wiring layer can be used for semiconductor devices of the next generation.