Showing papers in "Microelectronics Reliability in 2022"

TL;DR: In this paper , an antenna model for HF RFID tag was prepared using the tool HyperLynx 3D EM tool on the basis of the results of preliminary studies in the field of inkjet printing.

TL;DR: Wang et al. as mentioned in this paper proposed an interpretable scheme named VPA model for lithium-ion battery RUL prediction by integrating algorithms with sufficient mathematical support, where the trend signal (TS) and capacity regeneration signal (CRS) are obtained from capacity degradation sequence by variational mode decomposition algorithm.

TL;DR: In this article , the impact of different types of interface trap charges (ITCs) on electrical parameters of split source horizontal pocket Z shape TFET and Hetero Stack TFET was investigated using TCAD simulator.

TL;DR: In this paper , a C-band LNA circuit model is constructed to investigate the nonlinear effects and degradation characteristics of the LNA under HPM, and validate it against damaged samples analysis acquired in HPM injection experiment of LNA.

TL;DR: In this paper, a C-band LNA circuit model is constructed to investigate the nonlinear effects and degradation characteristics of the LNA under HPM, and validate it against damaged samples analysis acquired in HPM injection experiment of LNA.

TL;DR: Based on the theory of elastoplastic fracture mechanics and multi-physics coupling analysis, the authors explored the effects of multi-cracks and thermal-mechanical coupled load on the reliability of TSVs using numerical analysis.

TL;DR: In this paper , a pulsed gate-stress test (GSS) was proposed to determine the electrical parameter stability of SiC MOSFETs under application-like conditions over a lifetime.

TL;DR: In this paper , two types of latent damage were experimentally observed in commercial silicon carbide (SiC) power MOSFETs exposed to heavy ion, one is observed at bias voltages just below the degradation onset and it involves the gate oxide, while the other damage type is observed below the Single Event Burnout (SEB) limit, and it is attributed to alterations of the SiC crystal-lattice.

TL;DR: In this article , the effectiveness of various methods to remove moisture from printed circuit boards (PCBs) depending on PCB's type and process parameters was examined, and the most efficient method was high temperatures annealing, but it should be taken into account that the treatment can result in micro-damages and aging.

TL;DR: In this paper , the effect of trap charges on the performance of 22-nm Fully Depleted Silicon on Insulator (FDSOI) Negative Capacitance FET has been systematically investigated.

TL;DR: In this paper , the first FO-WLP processing steps are investigated in detail by performing extensive thermo-mechanical material characterization, temperature-dependent warpage measurements, and numerical simulations.

TL;DR: In this article , a machine learning model based on the back propagation (BP) method is proposed for predicting three-dimensional board-level drop responses of the ball grid array (BGA) packaging structures.

TL;DR: In this article, two types of latent damage were experimentally observed in commercial silicon carbide (SiC) power MOSFETs exposed to heavy ion, one is observed at bias voltages just below the degradation onset and it involves the gate oxide, while the other damage type is observed below the Single Event Burnout (SEB) limit, and it is attributed to alterations of the SiC crystal-lattice.

TL;DR: In this article , a TCAD-based investigation of virtually fabricated Π-shaped Gate p-GaN HEMT for reliable enhancement mode operation is presented, with a focus towards the trap related dispersive effect.

TL;DR: In this paper , the warpage of a panel in the context of fan-out packaging is analyzed and the resulting warpage is characterised temperature dependent using the Projection Moiré technique globally across the complete panel and locally on the scale of few dies.

TL;DR: In this article , the authors presented several practical aspects for building robust and reliable finite element models in thermomechanical modeling in electronics packaging using finite element analysis, and extended the local volume averaging method for large-area die attach problems.

TL;DR: In this article , the fatigue failure of gold wire bonding solder joints caused by the thermal cycling test was studied, and the mechanism of thermal fatigue failure can be summarized as the thermal mismatch of solder joint materials, residual stress due to the bonding process, and stress concentration caused by a wedge area.

TL;DR: In this article , the authors proposed a novel fault diagnosis methodology of IGBTs stated as GR-PTA-BN organically combining a genetic algorithm-rough set attribute reduction (GR) method with a precision and time performance evaluation algorithm (PTA) based on Bayesian network (BN).

TL;DR: In this paper , a Bayesian-based method to quantify battery capacity degradation using multiple health indicators extracted from the battery Thevenin model at different temperatures is presented. But, the method is limited to the battery aging level and to ensure electric vehicle security and reliability.

TL;DR: In this paper , the effect of critical EMC properties on warpage behavior is examined, and the gap in the literature is discussed to bring the prediction capability to a desired level, and three main reasons why the warpage prediction is still difficult are identified.

TL;DR: In this article , the effects of nano-particles (NPs) and nano-wires (NWs) on the properties of ECAs were studied under the same curing and aging conditions.

TL;DR: In this article , a new model based on finite element method (FEM) was proposed to simulate the Cu concentration distribution and the diffusion flux for the cold end IMC formation in Cu/Sn/Cu micro solder joints under temperature gradient (TG)-induced atomic thermomigration (TM) in micro solder joint.

TL;DR: In this paper , a fixed-free cantilever-type RF-MEMS shunt switch was proposed to alleviate the inherent high actuation voltage requirements of electrostatic shunt switches.

TL;DR: In this paper , the authors developed electrically conductive composite fine powder containing carbon nanotubes for use in the laser printing technique, and the obtained fine powder was tested towards compatibility with a desktop laser printer.

TL;DR: In this paper , the in-plane deformation of glass near the copper via during thermal cycling was measured by a two-dimensional digital image correlation (2D DIC) and numerical simulations were performed to provide an insight into the thermomechanical behavior of the copper-glass interface.

TL;DR: In this article , the authors investigated the reliability performance of a 1.7 kV/1.8 kA IGBT power module based on the New Dual power module and found that the power cycle lifetime of the new dual power module is more than ten times longer than the traditional power module.

TL;DR: In this article , a linear gate work function modulation was proposed for SOI-FinFETs with linear gate metal work function to maintain the electrostatic integrity of the device.

TL;DR: In this article , the effect of trap induced threshold voltage (VTH) instability and dynamic ON-resistance (RDS,ON) degradation on GaN gate HEMTs in power applications is examined for different operating regimes, including biasing voltage and temperature.

TL;DR: In this article , a three-dimensional (3D) computational model was developed to analyze the reliability of the copper trace lines in a stacked ball grid array (BGA) containing two dies under thermal cycling between −65 °C and 150 °C.

TL;DR: In this article, the authors proposed an accelerated degradation testing (ADT) model considering the self-heating impact in the degradation process of a light-emitting diodes (LEDs) component.