Journal ArticleDOI
A Damage-Mechanics-Based Constitutive Model for Solder Joints
TLDR
In this article, a viscoplasticity model unified with a thermodynamics-based damage concept is presented to model the thermal viscastic behavior and fatigue life of solder joints in microelectronics packaging.Abstract:
Sn-Pb eutectic solder alloy is extensively used in microelectronics packaging interconnects. Due to the high homologous temperature, eutectic Sn-Pb solder exhibits creepfatigue interaction and significant time-, temperature-, stress-, and rate-dependent material characteristics. The microstructure is often unstable, having significant effects on the flow behavior of solder joints at high homologous temperatures. Such complex behavior makes constitutive modeling an extremely difficult task. A viscoplasticity model unified with a thermodynamics-based damage concept is presented. The proposed model takes into account isotropic and kinematic hardening, and grain size coarsening evolution. The model is verified against various test data, and shows strong application potential for modeling thermal viscoplastic behavior and fatigue life of solder joints in microelectronics packaging. DOI: 10.1115/1.1939822read more
Citations
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Journal ArticleDOI
Computational damage mechanics of electromigration and thermomigration
Wei Yao,Cemal Basaran +1 more
TL;DR: In this article, a detailed formulation is presented to characterize material damage due to electromigration and thermomigration, and an entropy-based damage model is adopted to characterize the material degradation physics.
Journal ArticleDOI
Mechanothermodynamic Entropy and Analysis of Damage State of Complex Systems
TL;DR: An attempt to propose a generalized theory of evolution which is based on the concept of tribo-fatigue entropy, which is determined by the processes of damageability conditioned by thermodynamic and mechanical effects causing to the change of states of any systems.
Journal ArticleDOI
A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects
Juan Gomez,Cemal Basaran +1 more
TL;DR: In this paper, a viscoplastic constitutive model unified with a thermodynamics based damage evolution model is embedded into a couple stress framework in order to simulate low cycle fatigue response coupled to size effects.
Journal ArticleDOI
Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm
Juan Gomez,Cemal Basaran +1 more
TL;DR: In this article, a thermodynamics-based damage mechanics rate dependent constitutive model is used to simulate experiments conducted on thin layer eutectic Pb/Sn solder joints and the model is implemented into the commercial finite element code ABAQUS via its user material subroutine capability and validated against experimental results.
Journal ArticleDOI
Experimental verification of thermodynamic fatigue life prediction model using entropy as damage metric
T. Temfack,C. Basaran +1 more
TL;DR: In this article, a fatigue model based on entropy generation is presented and validated through experiments, which combines statistical mechanics with thermodynamic laws applied at a local scale, and does not require an empirical damage surface or phenomenological constitutive modeling constants.
References
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Journal ArticleDOI
A mathematical representation of the multiaxial Bauschinger effect
C. O. Frederick,Peter Armstrong +1 more
TL;DR: A mathematical representation of the multiaxial Bauschinger effect of materials at high temperatures was presented in this paper. But the model was not considered in this paper, nor in the paper.
Journal ArticleDOI
Constitutive equations for cyclic plasticity and cyclic viscoplasticity
TL;DR: In this paper, the cyclic constitutive equations developed and used at ONERA and LMT-Cachan are presented in detail in terms of a hierarchy of various models, including the Ohno-Kachi time-independent plasticity theory, two unified viscoplastic models by Walker and by Krempl and Yao, the new developments of the endochronic theory by Watanabe and Atluri.
Journal ArticleDOI
Constitutive relations for tin-based-solder joints
R. Darveaux,Kingshuk Banerji +1 more
TL;DR: In this article, extensive data on 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, 97.5Pb5Sn, and 95Pb6Sn solder assemblies were collected to properly account for the effects of grain size and intermetallic compound distribution.
Book
The Mechanics of solder alloy interconnects
TL;DR: In this paper, the mechanics of soldere alloy interconnects are discussed, and the mechanical properties of solder joints are predicted and accelerated testing is carried out for through-hole surface mount solder joints under thermal, mechanical and vibration conditions.
Journal ArticleDOI
A Thermodynamic Framework for Damage Mechanics of Solder Joints
Cemal Basaran,C.-Y. Yan +1 more
TL;DR: In this paper, a damage metric based on the second law of thermodynamics and statistical mechanics is presented, which treats a solid body as a thermodynamic system and requires that the entropy production be nonnegative.
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An Irreversible Thermodynamics Theory for Damage Mechanics of Solids
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