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Journal ArticleDOI

Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm

Juan Gomez, +1 more
- 01 Jul 2006 - 
- Vol. 38, Iss: 7, pp 585-598
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TLDR
In this article, a thermodynamics-based damage mechanics rate dependent constitutive model is used to simulate experiments conducted on thin layer eutectic Pb/Sn solder joints and the model is implemented into the commercial finite element code ABAQUS via its user material subroutine capability and validated against experimental results.
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This article is published in Mechanics of Materials.The article was published on 2006-07-01. It has received 58 citations till now. The article focuses on the topics: Damage mechanics & Finite element method.

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Journal ArticleDOI

Damage mechanics of electromigration induced failure

TL;DR: In this paper, a new damage mechanics formulation is implemented in a general finite element procedure and used for simulation of solder joints electromigration induced failure, where nonlinear viscoplastic time-dependent nature of the material and current crowding effects are taken into account in the formulation.
Journal ArticleDOI

A new unified constitutive model with short- and long-range back stress for lead-free solders of Sn―3Ag―0.5Cu and Sn―0.7Cu

TL;DR: In this article, a constitutive model was proposed to simulate the loading/unloading asymmetry phenomenon in uniaxial ratcheting tests with a simple formulation and only eight material constants which can be easily obtained.
Journal ArticleDOI

Review of methods to predict solder joint reliability under thermo-mechanical cycling

TL;DR: In this article, a review of modeling methods available to predict the lifetime of SnPb and SnAgCu solder joints under thermo-mechanical cycling conditions such as power cycling, accelerated thermal cycling and isothermal testing is presented.
Journal ArticleDOI

Computational damage mechanics of electromigration and thermomigration

TL;DR: In this article, a detailed formulation is presented to characterize material damage due to electromigration and thermomigration, and an entropy-based damage model is adopted to characterize the material degradation physics.
Journal ArticleDOI

Mechanothermodynamic Entropy and Analysis of Damage State of Complex Systems

Leonid A. Sosnovskiy, +1 more
- 20 Jul 2016 - 
TL;DR: An attempt to propose a generalized theory of evolution which is based on the concept of tribo-fatigue entropy, which is determined by the processes of damageability conditioned by thermodynamic and mechanical effects causing to the change of states of any systems.
References
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Book

A Course on Damage Mechanics

Jean Lemaitre
TL;DR: In this article, the authors present a detailed analysis of the physical properties of the solid state and damage, including elasticity, deformation, shrinkage, and elasticity of the material.
Journal ArticleDOI

A mathematical representation of the multiaxial Bauschinger effect

TL;DR: A mathematical representation of the multiaxial Bauschinger effect of materials at high temperatures was presented in this paper. But the model was not considered in this paper, nor in the paper.
Journal ArticleDOI

Constitutive equations for cyclic plasticity and cyclic viscoplasticity

TL;DR: In this paper, the cyclic constitutive equations developed and used at ONERA and LMT-Cachan are presented in detail in terms of a hierarchy of various models, including the Ohno-Kachi time-independent plasticity theory, two unified viscoplastic models by Walker and by Krempl and Yao, the new developments of the endochronic theory by Watanabe and Atluri.
Journal ArticleDOI

Constitutive relations for tin-based-solder joints

TL;DR: In this article, extensive data on 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, 97.5Pb5Sn, and 95Pb6Sn solder assemblies were collected to properly account for the effects of grain size and intermetallic compound distribution.
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