Book ChapterDOI
A micromechanics model of the initiation of grain-boundary crack in high-temperature fatigue
Manabu Tanaka,Hiroshi Iizuka +1 more
TLDR
In this article, a model which incorporated the recovery effect by diffusion of atoms is presented to explain the initiation of grain-boundary wedge-type crack in high-temperature fatigue.Abstract:
A continuum mechanics model which incorporated the recovery effect by diffusion of atoms is presented to explain the initiation of grain-boundary wedge-type crack in high-temperature fatigue. The direction of deformation is periodically changed in fatigue, and the crack initiation depends on the deformation history of the grain boundary. A theoretical calculation based on the present model was made on the grain-boundary crack initiation in high-temperature fatigue where the deformation is path-dependent. The calculation results satisfactorily explained the experimental observations in polycrystalline metallic materials.read more
Citations
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Journal ArticleDOI
The role of extrusions and intrusions in fatigue crack initiation
TL;DR: In this paper, the profiles of persistent slip markings produced by uniaxial and baoxial cyclic straining in four different polycrystalline materials with f.c. structure were investigated using focused ion beam (FIB) cutting and TEM observation of oriented surface foils.
Journal ArticleDOI
Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation
Pradeep Sharma,Abhijit Dasgupta +1 more
TL;DR: In this article, a micro-mechanistic approach for modeling fatigue damage due to cyclic creep in eutectic Pb-Sn solder is presented, where void nucleation, void growth, and void coalescence model based on m structural stress fields are estimated under viscop phenomena like grain boundary sliding, its blocking at second phase particles, and fusional creep relaxation.
Book ChapterDOI
Creep–Fatigue Interactions (Crack Initiation)
TL;DR: In this article, the origin of thermally induced stresses is covered and the background to creep-fatigue interaction explained with supporting experimental observations, and the prediction of crack initiation is examined with regard to temperature, strain rate and environmental effects.
Journal ArticleDOI
The Connection between Microstructural Damage Modeling and Continuum Damage Modeling for Eutectic Sn-Pb Solder Alloys
TL;DR: In this paper, the authors used insights obtained from the analysis of cyclic creep and cyclic plasticity to find the best damage metric for viscoplastic solders, such as Sn-Pb eutectic solders.
Journal ArticleDOI
Scaling exponent of grain-boundary sliding in creep deformation of polycrystalline materials
TL;DR: In this paper, the size distribution of large grain-boundary cracks was examined using crept specimens with different grainboundary con-gurations, namely, the specimen with serrated grain boundaries (Dgb 1:241, where Dgb is the fractal dimension of the grain-branch surface pro®le in the two-dimensional section (1, Dgb, 2)) in the cobalt-based HS-21 alloy; the value of a9 for these specimens, which was in the range from about 0.66 to 2.0, was
Related Papers (5)
Phase-field modeling of crack propagation in polycrystalline materials
Arezoo Emdadi,Mohsen Asle Zaeem +1 more